A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.

A surgical buttress for use in a surgical stapling apparatus is provided. The surgical buttress includes an elongate rectangular body portion defining a width; a nose portion integrally formed with and extending from a distal end of the body portion, the nose portion defining a width that is less than the width of the body portion; a neck portion integrally formed with and extending from a distal end of the nose portion, the neck portion defining a width; a head portion integrally formed with and connected to a distal end of the neck portion, the head portion defining a width; and a tail portion integrally formed with and extending from a proximal end of the body portion, the tail portion defining a width that is less that the width of the body portion. The surgical buttress is formed from a material having filaments. The surgical buttress include radioactive material.

A composite switchable pane array, having: a first pane; a second pane, and an intermediate layer arranged therebetween, wherein the intermediate layer has at least one first thermoplastic polymer film and one second thermoplastic polymer film, and an SPD film arranged therebetween; and an edge sealing arranged in the outer edge region of the intermediate layer, containing a polyimide (PI) and/or polyisobutylene (FIB).

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A fabrication method for a diary or electronic device cover, the fabrication method includes the steps of: disposing an elastic first synthetic resin on a joint panel; disposing a second synthetic resin on the first synthetic resin; disposing a third synthetic resin different from the first synthetic resin and the second synthetic resin in material; joining the first synthetic resin, the second synthetic resin, and the third synthetic resin at a plurality of points; and injecting air into a space between the first synthetic resin and the second synthetic resin to allow the cover to have a bulged surface.

A method for applying a label to an electrical cable having an outermost sheath with convolutions defining alternating peaks and valleys, the method including attaching the label to the sheath. The label includes a label substrate, the label substrate includes an attaching side, the attaching side being attached through an adhesive; and the label attaches to the peaks and spans across the valleys and circumferentially wraps around the sheath.

A lens assembly includes a stack of thermoplastic lenses that are aligned along a common optical axis and that are interleaved with metallic disks having an open central portion. Peripheral portions of each of the thermoplastic lenses adhere to the interleaved metallic disks to form a fused stack of lenses. A method of making the fused stack of lenses is disclosed and includes subjecting a set of interleaved lenses and metallic disks to an alternating current electromagnetic field that induces eddy currents in the metallic disks, causing heating that melts the adjacent lenses. The melted thermoplastic lens material adheres to adjacent metallic disks. The metallic disks reduce stray light from entering the lens stack, while permitting light to enter central portions of the lenses.