An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.

There is provided an adhesive application apparatus capable of efficiently applying an adhesive without inhibiting curing of the adhesive. An adhesive application apparatus of the present invention includes a mounting table 10, an adhesive dosing unit 20, and an ultraviolet irradiation unit 30, and it applies a delayed-ultraviolet-curable adhesive 200 to a surface of a panel 100. The panel 100 is mounted on a mounting surface S10 of the mounting table 10. The adhesive dosing unit 20 applies the adhesive 200 to the surface of the panel 100 mounted on the mounting table 10 by discharging the adhesive 200 from an adhesive dosing port H20. The ultraviolet irradiation unit 30 irradiates the adhesive 200 dosed from the adhesive dosing port H20 with ultraviolet light L. Here, the ultraviolet irradiation unit 30 irradiates the adhesive 200 with the ultraviolet light L along the mounting surface S10 before the adhesive 200 dosed from the adhesive dosing port H20 is applied to the surface of the panel 100.

An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.

An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.

A light, durable, and user friendly cover for a laptop computer that integrates the protective qualities of hard shell cases with the aesthetics of soft cut-and-sew covers is disclosed herein. The cover includes top and bottom panels configured to cover the display and keyboard portions, respectively. Each panel is independent and separate from the other and each is formed as a unitary component of a molded resilient polymer material, such as polycarbonate, that is configured to reversibly and retentively snap-fit over the outer surface of the laptop computer. Each panel includes a raised lip along its perimeter edge region that defines an internally extending recessed region on the panel's outer surface. Fabric and/or leather overlays are positioned, sized, and adhesively coupled atop the recessed regions and are protected from delaminating, fraying, and/or peeling by the raised perimeter lip.

A golf club with a multi-material face is disclosed herein. More specifically, the golf club head in accordance with the present invention has a multi-material striking face portion that is made out of a backing layer having a frontal pocket, made out of titanium, and an insert, made out of a composite material, adapted to be inserted into the frontal pocket. The frontal pocket and the insert could have complementary dovetail shaped undercut features to create a mechanical bond between these two components. The insert may be bonded to the frontal pocket using an adhesive impregnated within a glass fiber weave.

A golf club with a multi-material face is disclosed herein. More specifically, the golf club head in accordance with the present invention has a multi-material striking face portion that is made out of a backing layer having a frontal pocket, made out of titanium, and an insert, made out of a composite material, adapted to be inserted into the frontal pocket. The frontal pocket and the insert could have complementary dovetail shaped undercut features to create a mechanical bond between these two components. The insert may be bonded to the frontal pocket using an adhesive impregnated within a glass fiber weave.

Pile articles (20,22), especially pile weather stripping, and a method and apparatus (10) for making such articles where the backing (24) and the pile (26) are of unlike material, especially nylon yarn for the pile (26) and polypropylene containing material for the backing (24), wherein prior to the welding of the pile (26) to the backing (24) the pile is first pre-heated using ultrasonic energy to melt the pile in a region (65) thereof where the pile is ultrasonically welded to the backing and before the weld is made. The ultrasonic melting occurs upstream of the location where the pile (26) is welded to the backing (24) so that the ultrasonically pre-heated melted region (65) of the pile (26) can cool and become at least partially solidified. Then pile (26) at the pre-heated melted region (65) is welded to the backing (24) and causes a reactive or chemical weld to occur, thereby attaching the pile (26) to the backing (24).

An apparatus and a method for attaching functional elements, e.g. composed of metal, to a component, in particular to a component comprising fiber-reinforced plastic, while using a setting head, wherein the functional element has a contact surface provided with adhesive and wherein the adhesive can be supplied to the setting head in individual depots adapted to the functional elements on a carrier band is characterized in that the functional elements are taken over by a guide device and are each pressable to an adhesive depot and are subsequently guidable with the adhering adhesive depots and separately from the carrier band in the setting head to the setting position in front of a setting die.

An apparatus and a method for attaching functional elements, e.g. composed of metal, to a component, in particular to a component comprising fiber-reinforced plastic, while using a setting head, wherein the functional element has a contact surface provided with adhesive and wherein the adhesive can be supplied to the setting head in individual depots adapted to the functional elements on a carrier band is characterized in that the functional elements are taken over by a guide device and are each pressable to an adhesive depot and are subsequently guidable with the adhering adhesive depots and separately from the carrier band in the setting head to the setting position in front of a setting die.