Patent classifications
B29C65/48
Asymmetric polytetrafluoroethylene composite having a macro-textured surface and method for making the same
Polytetrafluoroethylene (PTFE) composite articles that have a macro textured surface. The composite articles include at least two different PTFE membranes in a layered or stacked configuration. The composite article has a macro textured surface characterized by a plurality of strands raised from the surface of the PTFE membrane. The strands may be formed of either interconnected nodes of PTFE or of at least one nodal mass of PTFE and have a length equal to or greater than about 1.5 mm. The macro textured surface provides a topography to the first PTFE membrane. The composite articles have a bubble point from about 3.0 psi to about 200 psi, a thickness from about 0.01 to about 3.0 mm, and a bulk density from about 0.01 g/cm.sup.3 to about 1.0 g/cm.sup.3.
Fastening objects to each other
A method of fastening at least one second object to at least one first object, wherein mechanical vibration acts from a sonotrode on the second object to fasten the second object to the first object. Between the sonotrode and the second object, an auxiliary sheet is placed, for example of paper. After the vibration stops, the auxiliary sheet is displaced relative to the sonotrode for a next fastening step.
Bonding process and system
A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.
Bonding process and system
A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.
Flexible sealing tube and method for producing the same
A flexible sealing tube is described that is adapted to be installed in and extend along a bore in the ground for use in a system for exchanging of energy with the ground. The flexible sealing tube has a first tube end to be installed at an inner part of said bore, and the flexible sealing tube is closed in the first tube end. The flexible sealing tube also has a first channel and a second channel extending in a longitudinal direction (L) of the flexible sealing tube, the first and second channels being in fluid connection with each other. The first and second channels are formed by the flexible sealing tube.
Semiconductor manufacturing apparatus
A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.
Semiconductor manufacturing apparatus
A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.
Interface shim fixture, and method using an interface shim fixture
A method for making a connection between a pair of objects includes using a fixture to hold in place shims used to control the gap thickness between the objects. The gap may be subsequently filled with adhesive that is then cured. The fixture may be a flexible piece of material that is able to withstand the cure environment, for example being able to withstand heat used to cure the adhesive. The fixture may facilitate maintaining the proper gap by holding the shims in their proper places and orientation until the adhesive is cured and the shims are removed. The use of the fixture may improve the uniformity of the gap at less effort, and may reduce defects in the adhesive layer, for example by facilitating removal of the shims without disturbing or damaging the adhesive, such as by pulling the shims straight out of their locations in the gap.
METHODS AND SYSTEMS FOR INSPECTING BONDED STRUCTURES
A method for inspecting a bonded structure, the bonded structure having a first structural member, a second structural member, and a bondline between the first structural member and the second structural member, includes projecting acoustic waves into the bonded structure at a non-zero angle relative to a normal axis defined by an external surface of the first structural member. The method further includes determining a magnitude of a total refraction of the acoustic waves after the acoustic waves pass through the bonded structure and comparing the magnitude of the total refraction to a predefined value.
METHODS AND SYSTEMS FOR INSPECTING BONDED STRUCTURES
A method for inspecting a bonded structure, the bonded structure having a first structural member, a second structural member, and a bondline between the first structural member and the second structural member, includes projecting acoustic waves into the bonded structure at a non-zero angle relative to a normal axis defined by an external surface of the first structural member. The method further includes determining a magnitude of a total refraction of the acoustic waves after the acoustic waves pass through the bonded structure and comparing the magnitude of the total refraction to a predefined value.