Methods for making structural shims (220) for the mating assembly of parts, such as for installation between a skin (212) and substructure (214) of an aircraft. The methods include the steps of disposing a hardenable composition (216) into a gap between the first (212) and second parts (214), hardening the hardenable composition to provide a shim pattern (218) that is dimensionally stable, and removing the shim pattern from the gap without damage. The shim pattern can be used to provide a digital model thereof, which can in turn be used to fabricate the structural shim (220).

One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

A molded article comprising a container top is disclosed. The molded article includes a threadless frame defining an opening, a flip cap located substantially coplanar with, and integrally formed with, the frame, a compound hinge between the frame and the flip cap, the hinge allowing the flip cap to rotate about the hinge to rest on top of the frame, an in-mold lidding film having a perimeter molded to the frame such that the in-mold lidding film covers the opening defined by the frame, wherein the in-mold lidding film is removable from the frame, and a pull tab, formed from the in-mold lidding film, that extends past the opening defined by the frame.

A molded article comprising a container top is disclosed. The molded article includes a threadless frame defining an opening, a flip cap located substantially coplanar with, and integrally formed with, the frame, a compound hinge between the frame and the flip cap, the hinge allowing the flip cap to rotate about the hinge to rest on top of the frame, an in-mold lidding film having a perimeter molded to the frame such that the in-mold lidding film covers the opening defined by the frame, wherein the in-mold lidding film is removable from the frame, and a pull tab, formed from the in-mold lidding film, that extends past the opening defined by the frame.

A package is provided that is formed from a packaging material, such as film, having increased adhesive in critical locations, such as adjacent folds in the end seal and other areas so that that the increased adhesive can at least partially fill voids adjacent such folds. The additional, localized sealant material is applied in a plurality of discrete locations in the end seal or other region adjacent where folds are formed and overlap with a sealant layer so as to provide additional sealant material for at least partially filling the voids without being present throughout the entirety, majority or large portions of the packaging material.

A heat-sealing apparatus for forming a composite heat seal structure, includes a belt conveying, heating and press bonding portion configured to convey and heat a heat seal material to form a band-shaped peelable seal, and a die roll press bonding portion configured to add a linear peelable seal to the band-shaped peelable seal in a longitudinal direction of the band-shaped peelable seal for forming the composite heat seal structure.

A heat-sealing apparatus for forming a composite heat seal structure, includes a belt conveying, heating and press bonding portion configured to convey and heat a heat seal material to form a band-shaped peelable seal, and a die roll press bonding portion configured to add a linear peelable seal to the band-shaped peelable seal in a longitudinal direction of the band-shaped peelable seal for forming the composite heat seal structure.

A robot includes a power bus assembly configured to receive a voltage and a continuous dock. The robot also includes a microcontroller in communication with the power bus assembly and the continuous dock. The microcontroller is configured to determine that the continuous dock is in contact with a surface that results in a voltage differential between the continuous dock and the surface. The microcontroller is also configured to activate a motor to apply a force that presses the continuous dock against the surface. The voltage causes a current to flow from the continuous dock to the surface such that a portion of the continuous dock melts and forms a bond to the surface.

A robot includes a power bus assembly configured to receive a voltage and a continuous dock. The robot also includes a microcontroller in communication with the power bus assembly and the continuous dock. The microcontroller is configured to determine that the continuous dock is in contact with a surface that results in a voltage differential between the continuous dock and the surface. The microcontroller is also configured to activate a motor to apply a force that presses the continuous dock against the surface. The voltage causes a current to flow from the continuous dock to the surface such that a portion of the continuous dock melts and forms a bond to the surface.

A package is provided that is formed from a packaging material, such as film, having increased adhesive in critical locations, such as adjacent folds in the end seal and other areas so that that the increased adhesive can at least partially fill voids adjacent such folds. The additional, localized sealant material is applied in a plurality of discrete locations in the end seal or other region adjacent where folds are formed and overlap with a sealant layer so as to provide additional sealant material for at least partially filling the voids without being present throughout the entirety, majority or large portions of the packaging material.