A forming die for pressure-forming workpieces comprises a die core and a core reinforcement in the form of a reinforcement member made of fibre-reinforced plastics material. The reinforcement member is radially pretensioned against the die core and comprises a plastics matrix and a reinforcing fibre structure which is embedded in the plastics matrix and which extends in the peripheral direction of the die core. A method for producing the forming die includes applying the the fibre-reinforced plastics material to the die core so as to produce a radial pretensioning of the reinforcement member against the die core.

A forming die for pressure-forming workpieces comprises a die core and a core reinforcement in the form of a reinforcement member made of fibre-reinforced plastics material. The reinforcement member is radially pretensioned against the die core and comprises a plastics matrix and a reinforcing fibre structure which is embedded in the plastics matrix and which extends in the peripheral direction of the die core. A method for producing the forming die includes applying the the fibre-reinforced plastics material to the die core so as to produce a radial pretensioning of the reinforcement member against the die core.

A delivery system for delivering a collapsible prosthetic heart valve includes a valve support structure for supporting a collapsible prosthetic heart valve, and a distal sheath movable in a longitudinal direction relative to the valve support structure between a first position in which the distal sheath is adapted to surround a collapsible prosthetic heart valve supported on the valve support structure, and a second position in which the distal sheath is adapted to expose the collapsible prosthetic heart valve for deployment. The distal sheath is at least partially formed of an inner polymer layer, an outer polymer layer, and a tubular supporting member sandwiched between the inner polymer layer and the outer polymer layer.

An intravenous delivery system may have a liquid source containing a liquid, tubing, and an anti-run-dry membrane positioned such that the liquid, flowing form the liquid source to the tubing, passes through the anti-run-dry membrane. The anti-run-dry membrane may be positioned within an exterior wall of a drip unit, and may be secured to a seat of the exterior wall by an attachment component. The attachment component may have various forms, such as a secondary exterior wall that cooperates with the exterior wall to define a drip chamber, a washer positioned such that the anti-run-dry membrane is between the washer and the seat, and an adhesive ring formed of a pressure sensitive adhesive and secured to the anti-run-dry membrane and the seat via compression. Interference features may protrude inward from the exterior wall or outward from the anti-run-dry membrane to help keep the anti-run-dry membrane in place.

An intravenous delivery system may have a liquid source containing a liquid, tubing, and an anti-run-dry membrane positioned such that the liquid, flowing form the liquid source to the tubing, passes through the anti-run-dry membrane. The anti-run-dry membrane may be positioned within an exterior wall of a drip unit, and may be secured to a seat of the exterior wall by an attachment component. The attachment component may have various forms, such as a secondary exterior wall that cooperates with the exterior wall to define a drip chamber, a washer positioned such that the anti-run-dry membrane is between the washer and the seat, and an adhesive ring formed of a pressure sensitive adhesive and secured to the anti-run-dry membrane and the seat via compression. Interference features may protrude inward from the exterior wall or outward from the anti-run-dry membrane to help keep the anti-run-dry membrane in place.

A method for manufacturing a semiconductor package by preparing a lead frame including a to-be-cut portion containing a Cu alloy; applying a joining material including Sn or a Sn alloy to the to-be-cut portion; heating the to-be-cut portion so as to react the Sn or Sn alloy and the Cu alloy so as to form an intermetallic compound having a void therein; and cutting the to-be-cut portion together with the intermetallic compound.

A method for manufacturing a semiconductor package by preparing a lead frame including a to-be-cut portion containing a Cu alloy; applying a joining material including Sn or a Sn alloy to the to-be-cut portion; heating the to-be-cut portion so as to react the Sn or Sn alloy and the Cu alloy so as to form an intermetallic compound having a void therein; and cutting the to-be-cut portion together with the intermetallic compound.

A reinforcing article (10, 100, 200) includes a porous substrate layer (105, 205) and a plurality of parallel first continuous fiber elements (12, 114, 212) spaced apart from each other and extending along a first direction and fixed to the porous substrate (105, 205). Each first continuous fiber element (12, 114, 212) includes a plurality of parallel and co-extending continuous fibers (22, 122, 222) embedded in a thermoplastic resin (24, 124, 224).

A composite component has a continuous-filament reinforced thermoplastic material (1) and a metallic insert (2), which is obtainable in that (a) a metallic insert (2) having pin structures (3) attached to the surface is provided, (b) firstly the pinned metallic insert (2) is inserted into a forming tool, (c) subsequently an optionally pre-heated organic sheet (1) manufactured from the continuous-filament reinforced thermoplastic (1) is disposed thereon, (d) the forming tool is closed and subsequent to a dwell time is optionally cooled to room temperature, and finally (e) the composite component (4) thus obtained is removed, is proposed.

Products and methods are provided for controlling thermal expansion. In various exemplary embodiments, a structure includes a body constructed of a material exhibiting a first coefficient of linear thermal expansion. A component is disposed inside the body and exhibits a second coefficient of linear thermal expansion that is lower than the first coefficient of linear thermal expansion. A layer is wrapped around the body and constrains thermal expansion of the body. The layer includes a composite containing fibers that are aligned with one another to constrain expansion in a desired direction or in multiple directions. The layer is independently useful to provide a retention function for the body.