A fiber-reinforced plastic chassis may include a steering element, where the steering element comprises at least one reinforcement structure formed with continuous fibers, where the steering element comprises at least one stiffening structure formed with short and/or long fibers, where the at least one reinforcement structure is formed integrally with the at least one stiffening structure via a thermosetting matrix material, and where the steering element comprises a plurality of bearing receivers integrated in at least one of the at least one reinforcement structure and the at least one stiffening structure for receiving bearing elements.

According to the present invention, in some embodiments, since a first resin, a first fabric and a second resin are layered and coupled to each other and the first resin and the second resin are coupled by through-holes of the first fabric, the first resin and the second resin are uniformly absorbed and coated on the surface of the first fabric, and the first resin, the first fabric, and the second resin are closely coupled to each other, thereby enabling a unique color of the first fabric to be displayed on the exterior, a travel bag having very excellent compactness, tensile strength and impact strength to be manufactured, a travel bag having excellent quality to be provided even if manufacturing costs and manufacturing processes are decreased, and a travel bag capable of maximizing user convenience and the operability of the travel bag by remarkably reducing the weight to be provided.

A construct for a hockey blade formed from layers of sheet molding compound material. The sheet molding compound material may be manufactured to have longer average fiber lengths entrained within the sheet molding compound material with random orientation in order to enhance the mechanical properties of the formed hockey stick blade.

A construct for a hockey blade formed from layers of sheet molding compound material. The sheet molding compound material may be manufactured to have longer average fiber lengths entrained within the sheet molding compound material with random orientation in order to enhance the mechanical properties of the formed hockey stick blade.

An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 m for electromagnetic signals having frequencies in a kilohertz range.

An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 m for electromagnetic signals having frequencies in a kilohertz range.

To suppress positional deviations of magnetic members of a stacked core and prevent damage thereto when the stacked core is attached to a case. A method for producing a stacked core including a stack of foil-shaped magnetic members for fixation to a case with a fastening bolt includes preparing magnetic members each having formed therein a positioning opening, and a tubular collar adapted to be fastened to the case with the fastening bolt inserted therethrough, the tubular collar having a first receiving face for a head of the fastening bolt and a second receiving face for the case, stacking the magnetic members while arranging the collar within the opening, impregnating gaps between the stacked magnetic members as well as gaps between the openings of the magnetic members and the outer peripheral face of the collar with resin, and integrating the magnetic members with the collar by curing the resin.

A method for producing a fiber composite component includes a step (a) that includes a production of a semi-finished product by: providing a core layer having cavities; covering an outer face of the core layer with a layer-shaped semi-finished product having continuous fibers pre-impregnated with a first duroplastic matrix material; and applying a molding compound to a first deposit area of a front face of the first semi-finished product, the front face facing away from the core layer, wherein the molding compound includes a second long-fiber-reinforced duroplastic matrix material. The method also includes a step (b) for extruded reshaping of the semi-finished product to the fiber composite component. The extruded reshaping is performed at an operating temperature, and the first and the second matrix material are configured such that flowability of the second matrix material is higher than flowability of the first matrix material during the reshaping.

A method for producing a fiber composite component includes a step (a) that includes a production of a semi-finished product by: providing a core layer having cavities; covering an outer face of the core layer with a layer-shaped semi-finished product having continuous fibers pre-impregnated with a first duroplastic matrix material; and applying a molding compound to a first deposit area of a front face of the first semi-finished product, the front face facing away from the core layer, wherein the molding compound includes a second long-fiber-reinforced duroplastic matrix material. The method also includes a step (b) for extruded reshaping of the semi-finished product to the fiber composite component. The extruded reshaping is performed at an operating temperature, and the first and the second matrix material are configured such that flowability of the second matrix material is higher than flowability of the first matrix material during the reshaping.

A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25 C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.