The present invention relates to a method of manufacturing a wind turbine blade, comprising arranging one or more layers of fibre material and a preform in a mould (66), injecting the one or more layers of fibre material and the preform (76) with a curable resin, and curing the resin. The preform (76) is impregnated with a curing promoter such that the concentration of curing promoter varies spatially within the preform.

In a method for printing a three dimensional structure, a continuous length of fiber that includes, interior to a surface of the fiber, a plurality of different materials arranged as an in-fiber functional domain, with at least two electrical conductors disposed in the functional domain in electrical contact with at least one functional domain material, is dispensed through a single heated nozzle. After sections of the length of fiber are dispensed from the heated nozzle, the sections are fused together in an arrangement of a three dimensional structure. The structure can thereby include a continuous length of fiber of least three different materials arranged as an in-fiber functional device, with the continuous length of fiber disposed as a plurality of fiber sections that are each in a state of material fusion with another fiber section in a spatial arrangement of the structure.

In a method for printing a three dimensional structure, a continuous length of fiber that includes, interior to a surface of the fiber, a plurality of different materials arranged as an in-fiber functional domain, with at least two electrical conductors disposed in the functional domain in electrical contact with at least one functional domain material, is dispensed through a single heated nozzle. After sections of the length of fiber are dispensed from the heated nozzle, the sections are fused together in an arrangement of a three dimensional structure. The structure can thereby include a continuous length of fiber of least three different materials arranged as an in-fiber functional device, with the continuous length of fiber disposed as a plurality of fiber sections that are each in a state of material fusion with another fiber section in a spatial arrangement of the structure.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

Fiber-reinforced composites is provided. The composites include a plurality of prepreg layers, each comprising a polymeric resin and a plurality of fibers disposed therein; and at least one electrically-conductive layer at least partially embedded in the plurality of prepreg layers. These fiber-reinforced composites can save weight relative to externally provided wires and can be provided in forms suitable for use in automated fiber placement and automated tape layup machines. Advantageous applications include uses in lightning strike protection, energy storage, signal transmission, and power distribution.

A manufacturing method of a three-dimensional stretchable electronic device includes: preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof; forming a path for a connection line for connecting the protrusions of the substrate using a wire; introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold; removing the wire and the three-dimensional stretchable substrate from the aluminum mold; injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

A manufacturing method of a three-dimensional stretchable electronic device includes: preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof; forming a path for a connection line for connecting the protrusions of the substrate using a wire; introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold; removing the wire and the three-dimensional stretchable substrate from the aluminum mold; injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

An IHS chassis houses a wireless communications device with an antenna. A IHS chassis wall includes aesthetic fiber layers that are free of a carbon fiber material and that provide both an inner and outer surface of the chassis wall. A plurality of composite fiber layers are located between the aesthetic fiber layers, with each composite fiber layer including a first fiber layer section with a carbon fiber material, and one or more second fiber layer sections that are free of a carbon fiber material and include a non-carbon fiber material that extends between the carbon fiber material in the first fiber layer section. The one or more second fiber layer sections align to provide one or more wireless transmission windows adjacent the antenna. The carbon fiber material and the non-carbon fiber material may have the same tow size to prevent the appearance of seams.

An IHS chassis houses a wireless communications device with an antenna. A IHS chassis wall includes aesthetic fiber layers that are free of a carbon fiber material and that provide both an inner and outer surface of the chassis wall. A plurality of composite fiber layers are located between the aesthetic fiber layers, with each composite fiber layer including a first fiber layer section with a carbon fiber material, and one or more second fiber layer sections that are free of a carbon fiber material and include a non-carbon fiber material that extends between the carbon fiber material in the first fiber layer section. The one or more second fiber layer sections align to provide one or more wireless transmission windows adjacent the antenna. The carbon fiber material and the non-carbon fiber material may have the same tow size to prevent the appearance of seams.

Exemplary methods for manufacturing a wire and resultant wires are disclosed herein. The method includes extruding a receptor cross-linkable polymer that is substantially free of curing agent about a conductive core and extruding a donor polymer in association with a curing agent. The method includes disposing the donor polymer about the receptor polymer and conductive core to create a multi-layer wire pre-product. The method also includes heat curing a multi-layer wire pre-product to form a wire.