Patent classifications
B29C70/88
Method and compositions for embedding electronics in fiber-composite parts fabricated via compression molding
A fiber-composite part having one or more electronic components that are located in arbitrary regions of the internal volume of the part are fabricated using a preform charge. The preform charge has a structure that corresponds to that of the mold cavity in which the part is being formed. By incorporating the electronic components in the preform charge, such components are then precisely located, spatially oriented, and constrained, and such location and orientation is maintained during molding to produce a part with the electronic components in the desired locations and orientations within its internal volume.
RADIATIVE COOLING STRUCTURES AND SYSTEMS
Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.
Method of manufacturing a composite part
A method of fabricating a composite material, the method comprises the steps of a) providing a first layer of a fibre reinforced polymer, preferably a thermoset FRP, b) providing an array of thermoplastic islands across at least a proportion of a major surface of the first layer, c) providing a second layer of a fibre reinforced polymer, preferably a thermoset FRP, d) laying the second layer over at least some of the islands, and e) securing the first and second layers together. There is also disclosed a composite which comprises a first layer of a fibre reinforced polymer and a second layer of a fibre reinforced polymer, between which is an intervening layer comprising an array of thermoplastic islands.
Method of manufacturing a composite part
A method of fabricating a composite material, the method comprises the steps of a) providing a first layer of a fibre reinforced polymer, preferably a thermoset FRP, b) providing an array of thermoplastic islands across at least a proportion of a major surface of the first layer, c) providing a second layer of a fibre reinforced polymer, preferably a thermoset FRP, d) laying the second layer over at least some of the islands, and e) securing the first and second layers together. There is also disclosed a composite which comprises a first layer of a fibre reinforced polymer and a second layer of a fibre reinforced polymer, between which is an intervening layer comprising an array of thermoplastic islands.
Pultrusion method and apparatus
Provided is a method of manufacturing a pultruded strip for an elongate structure. The method includes the step of: providing a pultrusion apparatus including at least a pultrusion die through which a plurality of fibers are pulled to be soaked in a resin, and changing the conduction properties of selected points along the plurality of fibers upstream the pultrusion die.
Pultrusion method and apparatus
Provided is a method of manufacturing a pultruded strip for an elongate structure. The method includes the step of: providing a pultrusion apparatus including at least a pultrusion die through which a plurality of fibers are pulled to be soaked in a resin, and changing the conduction properties of selected points along the plurality of fibers upstream the pultrusion die.
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
Methods of creating composite parts with fibers in a desired orientation
Methods comprise generating an electric field; encompassing fibers within the electric to orient the fibers in a desired orientation relative to each other; and subsequent to the encompassing, fixing the fibers in the desired orientation within a matrix material to at least partially create a composite part.
Composites
A composite which comprises a first layer of a fibre reinforced polymer and a second layer of a fibre reinforced polymer, between which is an intervening layer comprising an array of thermoplastic islands.