The present invention relates to monolithic bodies, uses thereof and processes for the preparation thereof. Certain embodiments of the present invention relate to the use of a monolithic body in the preparation of a radioactive substance, for example a radiopharmaceutical, as part of a microfluidic flow system and a process for the preparation of such a monolithic body.

The present invention relates to monolithic bodies, uses thereof and processes for the preparation thereof. Certain embodiments of the present invention relate to the use of a monolithic body in the preparation of a radioactive substance, for example a radiopharmaceutical, as part of a microfluidic flow system and a process for the preparation of such a monolithic body.

A three-dimensional object molding method and molding device, where the method includes the following steps: forming a powder particle layer, wherein the powder particle layer at least contains thermosetting powder particles capable of undergoing thermal polymerization; spraying a photocurable material onto the powder particle layer according to layer printing data, such that the photocurable material covers at least part of the powder particle layer and permeates into this layer; curing the photocurable material to form a slice layer; repeating the steps to obtain a plurality of slice layers, and stacking the plurality of slice layers layer-by-layer to form a three-dimensional object green body; and heating the green body to thermally polymerize the thermosetting powder particles so as to obtain the three-dimensional object. The method provided in the present application enables the obtained three-dimensional object to have very good mechanical properties and a high molding accuracy.

The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.

A polymer body includes a first thermoplastic polymer, and a second thermoplastic polymer. The first thermoplastic polymer and the second thermoplastic polymer form a continuous solid structure. The first thermoplastic polymer forms an external supporting structure that at least partially envelops the second thermoplastic polymer. A first flow temperature of the first thermoplastic polymer is at least 10° C. higher than a second flow temperature of the second thermoplastic polymer. The first thermoplastic polymer may be removable by exposure to a selective solvent.

An ETFE film that has a haze value of 2% or less, and preferably 1% or less, which advantageously may have a thickness greater than 150 pm, and preferably In the range of 200 pm to 300 pm, A film of ETFE, as received from the manufacturer, is stretched under special processing conditions to produce a processed (or final) film having an area stretch factor (Ax) greater than about 1.6. Ax —Initial film thickness/film thickness after stretching. However, it is important that the initial film thickness has a starting thickness of at least 400 pm, and preferably at least 500 pm. Processing conditions Include, in some embodiments, pre-beating and heating during stretching, and post-stretching annealing If the film is stretched in a 2.5×1 or a 4×1 ratio, at a processing temperature in THV range of 130° C. to 150° C., the haze of the resulting film can be reliably brought down to less than 2%. We have also found that this low haze value is not dependent on whether the larger stretch {e.g., 2,5× or 4×) is in the machine direction (MD) or the transverse direction (TD) of the extruded film. Annealing the stretched film decreases the film shrinkage to almost 0%.

An ETFE film that has a haze value of 2% or less, and preferably 1% or less, which advantageously may have a thickness greater than 150 pm, and preferably In the range of 200 pm to 300 pm, A film of ETFE, as received from the manufacturer, is stretched under special processing conditions to produce a processed (or final) film having an area stretch factor (Ax) greater than about 1.6. Ax —Initial film thickness/film thickness after stretching. However, it is important that the initial film thickness has a starting thickness of at least 400 pm, and preferably at least 500 pm. Processing conditions Include, in some embodiments, pre-beating and heating during stretching, and post-stretching annealing If the film is stretched in a 2.5×1 or a 4×1 ratio, at a processing temperature in THV range of 130° C. to 150° C., the haze of the resulting film can be reliably brought down to less than 2%. We have also found that this low haze value is not dependent on whether the larger stretch {e.g., 2,5× or 4×) is in the machine direction (MD) or the transverse direction (TD) of the extruded film. Annealing the stretched film decreases the film shrinkage to almost 0%.

An improved nozzle box is disclosed having side walls spaced apart from each other, a base and a ventilation wall spaced apart from it, thereby forming an interior space. A plurality of ventilation openings arranged offset to each other is provided in the ventilation wall, the nozzle box is provided on its ventilation wall with a plurality of protrusions that are raised by at least a height (H) in relation to the sections of ventilation wall or the top side or surface of the ventilation wall the sections being located adjacent to the protrusions, the ventilation openings are configured raised in the region of the protrusions in relation to the top side or surface of the ventilation wall and/or the ventilation wall includes in the transverse direction (Q) of the nozzle box opposing side flanges that overlap the side walls of the nozzle box outside the interior space of the nozzle box.