A nicotine lozenge provided herein includes a body that is partially or wholly receivable in an oral cavity. The body includes a soluble-fiber matrix and nicotine or a derivative thereof dispersed in the soluble-fiber matrix. In some cases, a nicotine lozenge provided herein includes at least 40 weight percent of soluble fiber. In some cases, soluble fiber in a nicotine lozenge provided herein can include maltodextrin. The nicotine lozenge is adapted to release the nicotine or a derivative thereof from the body when the body is received within the oral cavity of an adult consumer and exposed to saliva. A method of making nicotine lozenges provided herein includes forming a molten mixture of at least 40 weight percent soluble fiber, nicotine, and less than 15 weight percent water while maintaining a mixture temperature of less than 150 C. and portioning the molten mixture into a plurality of nicotine lozenges. In some cases, the ingredients can be mixed to form the molten mixture in an extruder.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

The automation of the assembly of a stack of substrates in the process of forming an object includes a blanking die having a push through plate to drive the blanked sheets onto a set of locating pins, thereby creating a very accurate stack. An image forming device may print and develop images onto a web that is subsequently die cut and stacked onto a curing platen. The die cutter cuts individual sheets out of the web and cuts or pre-cuts alignment holes into each sheet that would be accepted by the curing platen having locating pins corresponding to the alignment holes in the sheet. The die cutting operation includes a tamping device that would accurately transfer the sheets from the die to the curing platen. This stack may then be removed and/or processed to form a 3D object.

Biodegradable self-expanding polymer stent has an outer diameter of 0.25-40 mm, length of 5-250 mm, and closed-cell wall structure formed by struts, where ratio of inner diameter values before crimping and after crimping is in a range of 3 to 5, and made of a copolymer obtained from L-lactide, D-lactide, D,L-lactide, meso-lactide, glycolide, -caprolactone, trimethylene carbonate, p-dioxanone and compounds comprising functional groups capable of photopolymerization; supramolecular structure of the copolymer is oriented substantially circularly in a transversal cross section of the stent. Method of manufacturing includes extruding a tube of a polymer material; annealing the extruded polymer tube; laser cutting the extruded polymer tube to form a stent workpiece; heating the stent to above glass transition temperature of the polymer, crimping the stent workpiece uniformly over the entire outer surface thereof, and quenching at about minus 20 degrees Celsius; placing the quenched stent on a delivery means.

Provided is a method for producing a fiber-reinforced plastic having high mechanical properties and high productivity during molding of a complicated shape. A method for producing a fiber-reinforced plastic using a sheet substrate A is provided, the sheet substrate A being a substrate including one or more sheets of incised prepreg a, the incised prepreg a being a prepreg including unidirectionally oriented reinforcing fibers and a resin and having a plurality of incisions dividing the reinforcing fibers formed in the prepreg, wherein the method for producing a fiber-reinforced plastic includes a placement step (A) of placing a plurality of sheet substrates A in a mold such that each of the sheet substrates A forms an overlapping portion in which the sheet substrate A overlaps one or more other sheet substrates A and a non-overlapping portion in which the sheet substrate A does not overlap any other sheet substrates A, and a molding step of heating and pressing the plurality of sheet substrates A, and the total area of the overlapping portion and the non-overlapping portion is 50 to 100% relative to the area of a mold surface.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

A method for forming an article includes providing a sheet of material, optionally conditioning the sheet with a surface of a roller, forming the sheet to provide a web, and separating an article from the web to provide the article. An apparatus adapted to form the article from a sheet is provided.

A composite article assembly arrangement includes an all-in-one assembly station for supporting certain two-workpiece or composite article assembly methodologies with a view toward a preferred lid assembly application. The all-in-one assembly station includes a stationary main base plate, opposed intermediate compactor plates, and opposed outer plates, which compactor plates and outer plates are movable relative to the stationary main base plate. One or more continuous webs bearing thermoformed first and second workpieces are directed through the assembly station, which assembly station operates to both separate the first and second workpieces from the web(s) as directed therethrough and assemble the first and second workpieces in one clapping movement of the compactor plates and outer plates relative to the main base plate. The main base plate comprises an axial alignment chamber or cavity that operates to mechanically or structurally maintain axial alignment of the first and second workpieces during workpiece assembly.

A nicotine lozenge provided herein includes a body that is partially or wholly receivable in an oral cavity. The body includes a soluble-fiber matrix and nicotine or a derivative thereof dispersed in the soluble-fiber matrix. In some cases, a nicotine lozenge provided herein includes at least 40 weight percent of soluble fiber. In some cases, soluble fiber in a nicotine lozenge provided herein can include maltodextrin. The nicotine lozenge is adapted to release the nicotine or a derivative thereof from the body when the body is received within the oral cavity of an adult consumer and exposed to saliva. A method of making nicotine lozenges provided herein includes forming a molten mixture of at least 40 weight percent soluble fiber, nicotine, and less than 15 weight percent water while maintaining a mixture temperature of less than 150 C. and portioning the molten mixture into a plurality of nicotine lozenges. In some cases, the ingredients can be mixed to form the molten mixture in an extruder.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.