The present invention describes an innovative programmable micro-stamp pick and place apparatus and method. This invention provides a micro-stamp device having a patterned polymer membrane that is configured with micropillars. When a micro-stamp device, singly or arranged in an array or group, is inflated with a fluid, the patterned polymer membrane deforms from a planar state and this causes the micropillars to peel from the workpiece. This patterned polymer membrane can thus be used to pick and place electronic die(s) or chip(s), single or in an array or a group, during fabrication, or to pick and replace defective die(s) or chip(s) during a test and repair process.

A process includes layering a graphene layer onto a polymer layer to form a composite film.