A mandrel for a molding process that includes a first portion that has a first portion outer surface, a first portion inner surface, a first portion first end, and a first portion second end. A thickness of the first portion first end is greater than the first portion second end. A second portion has a second portion outer surface, a second portion inner surface, a second portion first end, and a second portion second end. A thickness of the second portion first end is smaller than the second portion second end. The first portion inner surface engages the second portion inner surface to form a mandrel that has a constant cross-section.

A film-integrated gasket is provided in which a gasket body is supported by a gasket support body formed of a resin film and a film thickness t.sub.2 at a position where the gasket body is supported is set to be smaller than a film thickness t.sub.1 at an adjacent position thereto so as to satisfy a demand for low reaction force by reducing the compression ratio in the thickness directional in mounting. The film-integrated gasket can be provided with a portion compressed in the thickness direction at the position where the gasket body is supported, so that the portion sets a thickness difference. The film-integrated gasket can alternatively be provided with a portion where a plurality of resin films is stacked at an adjacent position to the position where the gasket main body is supported, so that the portion sets a thickness difference.

A method of reclaiming a used seal includes boiling the used seal in a liquid, and after boiling the used seal in the liquid, baking the used seal. The boiling the used seal may include boiling for a predetermined boiling time in the liquid, and the baking the used seal may include baking the used seal for a predetermined bake time at a predetermined temperature.

A sealing method for sealing an opening of a metallic molded body with a resin molded body, the metallic molded body having a cavity therein and an opening connected to the cavity, includes a step of irradiating laser light onto a joining surface on a periphery of the opening of the metallic molded body in an energy density of 1 MW/cm.sup.2 or more and at an irradiation rate of 2000 mm/sec or more to roughen the surface, and a step of placing, in a mold, a portion including the joining surface of the metallic molded body roughened in the preceding step and sealing the opening with a resin molded body formed by injection molding or compression molding of a resin.

A trim piece for sealing a work surface including a body having a first side, a second side, and a span disposed between the first side and the second side, wherein the first side and the second side are joined at a junction defining an angle between the first side and the second side of between 80 degrees and 100 degrees, a topcap is affixed to the span of the body, wherein the topcap includes a left side having a first wing and a right side having a second wing, an adhesive is bonded to the first side of the body and an aperture is disposed within the body.

A foam-based expansion joint seal system packaging which facilitates transport and reduces the need for internal splices.

A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

In order to allow or improve a laminar air flow in a transition region between aerodynamic profile elements, a pressure plate arrangement is proposed. The pressure plate arrangement comprises a pressure plate body and at least one cover strip, in particular a sealing strip. The pressure plate body has an outlet region from which free-flowing sealant can exit during pressing. The cover strip already contains cured sealant and presses the free-flowing sealant flat in order to be able to form the transition region.

A container for an aerosol-generating device is provided, including a tubular compartment including a liquid compound source and being formed from a polymeric material; and at least one seal formed from the polymeric material and being configured to seal the tubular compartment, where a ratio of thermal conductivity per unit weight in a radial direction of the polymeric material to thermal conductivity per unit weight in a longitudinal direction of the polymeric material is greater than about 2, or where a ratio of thermal conductivity per unit weight in the longitudinal direction of the polymeric material to thermal conductivity per unit weight in the radial direction of the polymeric material is above about 2. An aerosol-generating system is also provided, including an aerosol-generating device configured to receive the container.