To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.

An objective of this disclosure is to provide a method of reusing a resin shaped product including an alicyclic structure-containing polymer, which can obtain a recycled article of the resin shaped product having reduced appearance defects and improved physical properties such as color tone. The presently disclosed method of reusing a resin shaped product including an alicyclic structure-containing polymer includes grinding the resin shaped product to obtain shaped product ground products; and dissolving the shaped product ground products in a mixed solvent containing not less than 80 weight % and not more than 98 weight % of cyclohexane and not less than 2 weight % and not more than 20 weight % of a hydrocarbon-based or aromatic solvent having a coagulation point of 40 C. or lower per 100 weight % of the mixed solvent to obtain a polymer solution.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

A method is described for making a retort container having one or two metal ends. A heat-sealable material is present on one or both of the container side wall and the/each metal end. The/each metal end is seamed onto the container body, and the resulting container assembly is conveyed on a conveyor adjacent to an induction sealing head and then adjacent to a cooling device. A pressure belt engages the upper end of the container assembly to keep the metal end from coming off the container body during the induction heating and cooling processes.

A method is described for making a retort container having one or two metal ends. A heat-sealable material is present on one or both of the container side wall and the/each metal end. The/each metal end is seamed onto the container body, and the resulting container assembly is conveyed on a conveyor adjacent to an induction sealing head and then adjacent to a cooling device. A pressure belt engages the upper end of the container assembly to keep the metal end from coming off the container body during the induction heating and cooling processes.

Cyclic olefin copolymer (COC) is useful as a build material for 3D printing, especially desktop 3D printing.

A method includes applying to a substrate a solution including a polymeric compound to form a release layer on the substrate; applying ion-conducting elements on the release layer; applying a matrix polymer on the release layer, wherein the matrix polymer surrounds at least some of the ion-conducting elements; and removing the release layer to separate the matrix polymer from the substrate such that the ion-conducting elements remain embedded in a carrier layer of the matrix polymer and form an ion-conducting membrane.

The present invention provides a heat shrinkable multilayer film that has low density, excellent shrinkage properties, and high rigidity, is less likely to suffer delamination, and also has excellent transparency. The present invention relates to a heat shrinkable multilayer film, containing: front and back layers; and an interlayer, the front and back layers each containing 60 to 80% by weight of a cyclic olefin resin and 20 to 40% by weight of an ethylene resin, the interlayer containing 50 to 80% by weight of an olefin resin and 20 to 50% by weight of a plastic resin, the interlayer containing 35 to 70 mol % of a propylene component, 1 to 10 mol % of an ethylene component, and 1 to 10 mol % of a butene component, based on 100 mol % of resin components constituting the interlayer.

The invention relates to a method for producing a syringe with an integrated closure element, which method comprises the following method steps: a) making available an injection moulding tool which comprises a first, a second and a third tool portion, wherein the first tool portion has a mould cavity open at both sides and extending along an axial direction (X), and wherein the second tool portion has a first injection moulding core and the third tool portion has a second injection moulding core; b) closing the injection moulding tool such that the first tool portion contacts the second and third tool portion, and the first and second injection moulding core each enter the mould cavity of the first tool portion through an opening and finally contact each other, as a result of which these tool portions form a first structural cavity; c) injecting a first plastic material into the first structural cavity, as a result of which a hollow cylindrical syringe body is formed with an end region at its distal end, wherein the end region has an attachment element, provided with an inner thread, and a hollow cylindrical endpiece which is at least partially bounded by the attachment element; d) cooling the tool portions, as a result of which the syringe body cools and hardens; e) bringing the first tool portion into contact with a fourth tool portion provided with a mould cavity closed at one end, as a result of which a second structural cavity is formed at the distal end of the syringe body; f) injecting a second plastic material into the second structural cavity, as a result of which the closure element is integrally formed on the attachment element, wherein the first and the second plastic material do not enter into a cohesive connection.