The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

It is an object of the invention to provide an optical laminate-producing method in which a polarizing film having the desired optical properties can be conveniently formed on a resin film as a substrate without performing any surface alignment treatment such as rubbing on the resin film. The invention relates to a method for producing an optical laminate comprising a stretched resin film and a polarizing film, the method comprising the steps of: preparing a stretched resin film; applying a solution of a liquid crystal compound in an isotropic phase state to the stretched resin film; and forming a polarizing film in which the liquid crystal compound is aligned by solidifying the applied liquid crystal compound solution, wherein a slow axis of the stretched resin film is substantially parallel to an absorption axis of the polarizing film, and the stretched resin film undergoes no surface alignment treatment.

The present invention relates to a method for producing an expanded beads molded article including performing in-mold molding by a molding method of filling expanded thermoplastic elastomer beads in a mold in a compressed state, in which expanded thermoplastic elastomer beads having a particular bulk density and a particular closed cell ratio are used, and a particular relationship between the internal pressure of the expanded beads and the compression filling ratio is satisfied. According to the method, an expanded thermoplastic elastomer beads molded article excellent in appearance, excellent in dimensional stability, and excellent in fusion bondability, compression characteristics, and rebound resilience of the expanded beads can be produced.

A flow cell and a method for connecting components of a microfluidic flow cell, in particular for integrating component parts into a carrier structure of the flow cell, in which a gap is formed between the components to be connected. The gap is filled with a solvent. The material of at least one component bordering the gap dissolves in the solvent and the material completely fills the width of the gap and partially fills the height thereof after evaporation of the solvent.

A flow cell and a method for connecting components of a microfluidic flow cell, in particular for integrating component parts into a carrier structure of the flow cell, in which a gap is formed between the components to be connected. The gap is filled with a solvent. The material of at least one component bordering the gap dissolves in the solvent and the material completely fills the width of the gap and partially fills the height thereof after evaporation of the solvent.

A method is described for making a retort container having one or two metal ends. A heat-sealable material is present on one or both of the container side wall and the/each metal end. The/each metal end is seamed onto the container body, and the resulting container assembly is conveyed on a conveyor adjacent to an induction sealing head and then adjacent to a cooling device. A pressure belt engages the upper end of the container assembly to keep the metal end from coming off the container body during the induction heating and cooling processes.

A method is described for making a retort container having one or two metal ends. A heat-sealable material is present on one or both of the container side wall and the/each metal end. The/each metal end is seamed onto the container body, and the resulting container assembly is conveyed on a conveyor adjacent to an induction sealing head and then adjacent to a cooling device. A pressure belt engages the upper end of the container assembly to keep the metal end from coming off the container body during the induction heating and cooling processes.

An optical layered body including: a substrate layer formed of a resin containing a crystallizable polymer A; and a first surface layer formed of a resin containing an amorphous polymer B, wherein a glass transition temperature TgA of the crystallizable polymer A and a glass transition temperature TgB of the amorphous polymer B satisfy TgB>TgA, a crystallization temperature TcA of the crystallizable polymer A and the glass transition temperature TgB of the amorphous polymer B satisfy TcA10 C.TgBTcA60 C., the first surface layer has a plane orientation coefficient P that satisfies P0.01, and a ratio of a thickness of the substrate layer relative to a total thickness of the optical layered body is 25% or more.

A resin film including a crystallizable polymer, wherein an in-plane retardation Re of the resin film is less than 5 nm, a thickness-direction retardation Rth of the resin film is less than 25 nm, and a haze HZ of the resin film is less than 3.0%.