A synthetic closure for a product-retaining container is constructed for being inserted and securely retained in a portal-forming neck of said container, said closure comprising at least a core member comprising at least one cycloolefin-based copolymer.

The present disclosure provides a port. In an embodiment, a port is provided and includes (i) an optional top portion, (ii) a base, and a channel extending through the optional top portion and the base for passage of a flowable material, and (iii) a septum extending across the channel. The septum comprises an ethylene/?-olefin multi-block copolymer.

The present disclosure provides a port. In an embodiment, a port is provided and includes (i) an optional top portion, (ii) a base, and a channel extending through the optional top portion and the base for passage of a flowable material, and (iii) a septum extending across the channel. The septum comprises an ethylene/?-olefin multi-block copolymer.

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

A heat shrinkable film manufacturing method includes: preparing packaging materials including film labels having resin layers mainly including thermoplastic resin and print layers; preparing first and second virgin raw materials of thermoplastic resin; recovering, from the resin layers, a recycled raw material of thermoplastic resin; and forming a resin-based film including the recycled raw material as a raw material so as to have a core layer and a surface layer layered on the core layer wherein the forming the resin film includes at least one of: forming the core layer including at least the recycled raw material and the first virgin raw material and the surface layer mainly including the second virgin raw material; and forming the core layer including the first virgin raw material and the surface layer including the second virgin raw material and at most 25 wt % of the recycled material.

A microchannel chip with which channel deformation does not occur even when high-temperature and high-pressure sterilization treatment is performed and with which strong joining performance of substrates is maintained; and a method for manufacturing the same are provided. A microchannel chip comprising: a channel substrate having a microchannel formed on at least one surface thereof; a lid substrate; and a joining layer joining the channel substrate and the lid substrate, wherein the channel substrate, the lid substrate, and the joining layer are each formed of a cycloolefin polymer, a glass-transition temperature Tg.sub.s1 of a cycloolefin polymer forming the channel substrate, a glass-transition temperature Tg.sub.s2 of a cycloolefin polymer forming the lid substrate, and a glass-transition temperature Tg.sub.2 of a cycloolefin polymer forming the joining layer have relationships: Tg.sub.s1>Tg.sub.2; and Tg.sub.s2>Tg.sub.2, and the joining layer has a thickness within a specific range.

A microchannel chip with which channel deformation does not occur even when high-temperature and high-pressure sterilization treatment is performed and with which strong joining performance of substrates is maintained; and a method for manufacturing the same are provided. A microchannel chip comprising: a channel substrate having a microchannel formed on at least one surface thereof; a lid substrate; and a joining layer joining the channel substrate and the lid substrate, wherein the channel substrate, the lid substrate, and the joining layer are each formed of a cycloolefin polymer, a glass-transition temperature Tg.sub.s1 of a cycloolefin polymer forming the channel substrate, a glass-transition temperature Tg.sub.s2 of a cycloolefin polymer forming the lid substrate, and a glass-transition temperature Tg.sub.2 of a cycloolefin polymer forming the joining layer have relationships: Tg.sub.s1>Tg.sub.2; and Tg.sub.s2>Tg.sub.2, and the joining layer has a thickness within a specific range.

A cyclic olefin resin composition film having high toughness with less difference in toughness between length and width directions. The cyclic olefin resin composition film contains a cyclic olefin resin, a styrene elastomer and inorganic oxide fine particles having an average particle diameter of 40 nm or smaller, and has a linear expansion coefficient of 40 ppm/ C. to 60 ppm/ C. This film attains high toughness with less difference in toughness between length and width directions.

The present invention provides a heat shrinkable multilayer film that has low density, excellent shrinkage properties, and high rigidity, is less likely to suffer delamination, and also has excellent transparency. The present invention relates to a heat shrinkable multilayer film, containing: front and back layers; and an interlayer, the front and back layers each containing 60 to 80% by weight of a cyclic olefin resin and 20 to 40% by weight of an ethylene resin, the interlayer containing 50 to 80% by weight of an olefin resin and 20 to 50% by weight of a plastic resin, the interlayer containing 35 to 70 mol % of a propylene component, 1 to 10 mol % of an ethylene component, and 1 to 10 mol % of a butene component, based on 100 mol % of resin components constituting the interlayer.