Patent classifications
B29K2025/04
Resin end-face butt joint, method for welding the joints, and piping member
A resin end-face butt joint, a method for welding the joints, and a piping member ensure a sufficient clamping margin with the clamp of an ordinary welding machine, and ensure an appropriate distance between the centers even when joints having short tubular welding ring parts are welded. It is also possible to align the centers by positioning the centers along the same axis. The resin end-face butt joint includes multiple welding ring parts which communicate with a flow path within a joint base part and which are provided on the joint base part. Fastening parts are coaxial with at least one of these welding ring parts at the outer end of the joint for the purpose of clamping a welding machine.
Peelable seals including porous inserts
Peelable seals including porous inserts are described. An example peelable seal includes a porous insert positioned between a first sheet and a second sheet. The porous insert includes a plurality of interwoven strands and a plurality of pores adjacent the interwoven strands through which a bond is formed between the first sheet and the second sheet when heat is applied to at least one of the first sheet, the second sheet or the porous insert.
Peelable seals including porous inserts
Peelable seals including porous inserts are described. An example peelable seal includes a porous insert positioned between a first sheet and a second sheet. The porous insert includes a plurality of interwoven strands and a plurality of pores adjacent the interwoven strands through which a bond is formed between the first sheet and the second sheet when heat is applied to at least one of the first sheet, the second sheet or the porous insert.
REUSABLE, NON-ADHESIVE PROTECTIVE COVER
A reusable, non-adhesive protective cover is disclosed which includes a first layer having an exterior surface designed to contact a structure or object during use and a second layer having an exterior surface designed to be spaced away from the structure or object. Each of the first and second layers are formed from a thermoplastic film and are joined together to form a laminate which is free of polyvinyl chloride. Each of the first and second layers contains at least about 5% of a flame retardant. The first layer has a static coefficient of friction of at least about 0.5. The second layer exhibits attachment and release capabilities such that a joint tape can be used to join adjacent sheets of the reusable, non-adhesive protective cover together and the joint tape can be removed without damaging the reusable, non-adhesive protective cover.
Heat-shrinkable film for label with low specific gravity and method for preparing the same
A heat-shrinkable label film includes a foamed layer having polystyrene as a principal component, and a pair of non-foamed layers adhesively melted to either side of the foamed layer, wherein the foamed layer and the pair of the non-foamed layers are coextruded to provide a low specific gravity less than 1.0. The film is prepared by coextruding to form the several layers completing a non-drawn film; and drawing the non-drawn film in a transverse direction (TD) at a drawing ratio of 3.5 to 5.5. The foamed ratio of the foamed layer is in the range of 5 to 20%. The thickness of the foamed layer is 60 to 90% of the total thickness of the film; and the thickness of each non-foamed layer is 5 to 20% of the total thickness of the film. The heat-shrinkable label film has a thickness of 30 to 60 m.
THERMOPLASTIC RESIN FILM LAMINATE AND MOLDED ARTICLE COMPRISING THERMOPLASTIC RESIN FILM LAMINATE
Provided is a thermoplastic resin film laminate, which is obtained by ultrasonic welding of a thermoplastic resin film and a thermoplastic resin molded article, and which has high welding strength and excellent appearance with less welding marks. The above-described problem is solved by a thermoplastic resin film laminate which is obtained by bonding, by ultrasonic welding, a thermoplastic resin film having a thickness of 0.4 mm or less and a welding margin of a thermoplastic resin molded article having the welding margin and having a thickness of 0.5 mm or more, and wherein the height of the welding margin is 75-125% of the thickness of the thermoplastic resin film.
THERMOPLASTIC RESIN FILM LAMINATE AND MOLDED ARTICLE COMPRISING THERMOPLASTIC RESIN FILM LAMINATE
Provided is a thermoplastic resin film laminate, which is obtained by ultrasonic welding of a thermoplastic resin film and a thermoplastic resin molded article, and which has high welding strength and excellent appearance with less welding marks. The above-described problem is solved by a thermoplastic resin film laminate which is obtained by bonding, by ultrasonic welding, a thermoplastic resin film having a thickness of 0.4 mm or less and a welding margin of a thermoplastic resin molded article having the welding margin and having a thickness of 0.5 mm or more, and wherein the height of the welding margin is 75-125% of the thickness of the thermoplastic resin film.
PROCESS FOR THE PRODUCTION OF EXPANDABLE VINYL AROMATIC POLYMER GRANULATE HAVING DECREASED THERMAL CONDUCTIVITY
The invention relates to an extrusion process for the production of expandable vinyl aromatic polymer granulate comprising mixing first and second additives with first and second polymer components, respectively, in dedicated mixers.
MICRO FLOW CHANNEL CHIP AND METHOD FOR PRODUCING FLOW CHANNEL CHIP
Provided is a method for producing a micro flow channel chip that is used for a treatment or analysis of a liquid sample, the method being capable of producing a micro flow channel chip with high shape accuracy and high efficiency. The method includes a step of forming a groove on one surface of a base material; a lamination step of forming an adhesive resin layer on at least one surface of a resin film, and thereby obtaining a first laminate; and an adhesion step of arranging the surface of the base material where a groove has been formed and the adhesive resin layer of the first laminate to face each other, and bonding the base material and the first laminate such that the adhesive resin layer covers the groove, in which the glass transition temperature of the adhesive resin layer is 25 C. or lower.
MICRO FLOW CHANNEL CHIP AND METHOD FOR PRODUCING FLOW CHANNEL CHIP
Provided is a method for producing a micro flow channel chip that is used for a treatment or analysis of a liquid sample, the method being capable of producing a micro flow channel chip with high shape accuracy and high efficiency. The method includes a step of forming a groove on one surface of a base material; a lamination step of forming an adhesive resin layer on at least one surface of a resin film, and thereby obtaining a first laminate; and an adhesion step of arranging the surface of the base material where a groove has been formed and the adhesive resin layer of the first laminate to face each other, and bonding the base material and the first laminate such that the adhesive resin layer covers the groove, in which the glass transition temperature of the adhesive resin layer is 25 C. or lower.