A preform coating device is provided with: a rotational holding part that horizontally holds a preform and rotates the preform about the axis of the preform, and that grasps a spout of the preform; a conveyance part that conveys the preform by moving the rotational holding part; a dispenser that discharges a coating liquid toward the preform; a preform support part that supports the bottom-side end of the cylindrical barrel of the preform while the dispenser is discharging the coating liquid; and a spout support part that supports the outer circumferential surface of the spout of the preform while the dispenser is discharging the coating liquid.

A process for packaging a product arranged on a support comprising unrolling a film, moving the film to a packaging assembly defining at its inside a packaging chamber, progressively moving a number of supports inside the packaging chamber of the packaging assembly, closing the packaging chamber with the film sheets held above the respective support, optionally causing one or both of: a gas withdrawal from the hermetically closed packaging chamber and gas injection of a gas mixture of controlled composition, heat sealing the film to said support, wherein the heat sealing uses one or more heaters having heating surfaces which are heated for discrete and short time periods only. An apparatus for performing the above process is also disclosed.

A process for packaging a product arranged on a support comprising unrolling a film, moving the film to a packaging assembly defining at its inside a packaging chamber, progressively moving a number of supports inside the packaging chamber of the packaging assembly, closing the packaging chamber with the film sheets held above the respective support, optionally causing one or both of: a gas withdrawal from the hermetically closed packaging chamber and gas injection of a gas mixture of controlled composition, heat sealing the film to said support, wherein the heat sealing uses one or more heaters having heating surfaces which are heated for discrete and short time periods only. An apparatus for performing the above process is also disclosed.

A process for packaging a product arranged on a support comprising unrolling a film, moving the film to a packaging assembly defining at its inside a packaging chamber, progressively moving a number of supports inside the packaging chamber of the packaging assembly, closing the packaging chamber with the film sheets held above the respective support, optionally causing one or both of: a gas withdrawal from the hermetically closed packaging chamber and gas injection of a gas mixture of controlled composition, heat sealing the film to said support, wherein the heat sealing uses one or more heaters having heating surfaces which are heated for discrete and short time periods only. An apparatus for performing the above process is also disclosed.

A process for packaging a product arranged on a support comprising unrolling a film, moving the film to a packaging assembly defining at its inside a packaging chamber, progressively moving a number of supports inside the packaging chamber of the packaging assembly, closing the packaging chamber with the film sheets held above the respective support, optionally causing one or both of: a gas withdrawal from the hermetically closed packaging chamber and gas injection of a gas mixture of controlled composition, heat sealing the film to said support, wherein the heat sealing uses one or more heaters having heating surfaces which are heated for discrete and short time periods only. An apparatus for performing the above process is also disclosed.

Provided is a method of bonding two surfaces, which includes providing nitrogen or ammonia plasma to a plastic material where a polysiloxane contacted, and a construct manufactured therefrom.

Provided is a method of bonding two surfaces, which includes providing nitrogen or ammonia plasma to a plastic material where a polysiloxane contacted, and a construct manufactured therefrom.

A method for increasing the adhesion between the first surface of a first web-type material and a first surface of a second web-type material, the first web-type material and the second web-type material being supplied to a lamination nip continuously and with the same direction of the web. In said nip, the first surface of the first web-type material and of the second web-type material are laminated together and both first surfaces are treated with a plasma over the whole surface. The lamination nip is formed by a pressure roller and a counter-pressure roller and at least one of the surfaces of the rollers or both are equipped with a dielectric. The plasma or the corona is produced by a nozzle. The first web-type material comprises an adhesive compound layer arranged in the first web-type material such as to form the first surface of the first web-type material.

A method for increasing the adhesion between the first surface of a first web-type material and a first surface of a second web-type material, the first web-type material and the second web-type material being supplied to a lamination nip continuously and with the same direction of the web. In said nip, the first surface of the first web-type material and of the second web-type material are laminated together and both first surfaces are treated with a plasma over the whole surface. The lamination nip is formed by a pressure roller and a counter-pressure roller and at least one of the surfaces of the rollers or both are equipped with a dielectric. The plasma or the corona is produced by a nozzle. The first web-type material comprises an adhesive compound layer arranged in the first web-type material such as to form the first surface of the first web-type material.

A flow sensor includes an auxiliary channel having an opening into which a fluid to be measured is taken; a sensor element that measures the flow of the fluid to be measured; a housing that accommodates electronic parts; and a resin cover. The flow sensor is configured such that junctions of the housing and the cover are formed in locations where first target weld portions, which are formed so that the circuit chamber is surrounded, face each other and second target weld portions, which are disposed for additional reinforcement of the joints, face each other on a bonding face of the housing and a bonding face of the cover with a step being provided. The positioning of the housing and the cover is determined, and the first target weld portions are welded to each other and second target weld portions are welded to each other by way of laser radiation.