B29K2033/04

Inks comprising gellants for 3D printing
09732241 · 2017-08-15 · ·

In one aspect, methods of printing a three-dimensional article are described herein. In some embodiments, a method described herein comprises jetting an ink at a temperature T1 onto a substrate at a temperature T2 to form a layer of the ink on the substrate. The method further comprises subsequently curing the layer of the ink. In some embodiments, T1 is greater than T2 and the ink in an uncured state has a liquid-gel transition temperature below T1 and above T2. Further, the layer of the ink is deposited on the substrate at a rate R1 in mg/s/in.sup.2 that is within 60% of a gelation rate R2 of the ink in inverse minutes in an uncured state at T2. The ink can comprise a curable material and a gellant.

METHOD FOR CREATING A FOAMED MASS SYSTEM

A method for producing a foamed thermally crosslinked mass system, wherein the mass system is foamed at a first temperature in a first step, and crosslinker substances are added to the mass system in a subsequent step at a second temperature lower than the first temperature, wherein the crosslinker substances are crosslinker substances for thermal crosslinking of the mass system.

METHOD FOR PREPARING FOAM FOR SUPPORTING LIQUID-PHASE COSMETIC MATERIAL AND SAME FOAM

The present invention relates to a method for preparing a foam for impregnating a liquid-phase cosmetic material, wherein the foam can be used while impregnating a liquid-phase or solid-phase cosmetic composition, such as a solution, an emulsion, a gel, a cream, or a suspension. According to the present invention, disclosed is a method for preparing a foam for impregnating a liquid-phase cosmetic material, the method comprising the steps of: (a) preparing a polyester polyol obtained by putting a polyester polyol in a chamber, followed by deflation at a temperature of 55-65° C. and mitigation under conditions of a pressure of 0.1-0.2 kPa for 60 minutes, and then lowering the temperature to 25-35° C. followed by supply of nitrogen and mitigation under conditions of a pressure of 2-3 kPa for 48 hours; (b) preparing a polyether polyol obtained by putting a polyether polyol in a chamber, followed by mitigation under conditions of a temperature of 15-25° C. and a pressure of 0.1-0.2 kPa for 60 minutes, supply of nitrogen, and mitigation under conditions of ,a pressure of 2-3 kPa for 48 hours; (c) injecting and preparing a foaming agent, a catalyst, and a surfactant in tanks according to capacity demands, respectively; (d) sequentially putting, in a mixing and stirring tank, the polyester polyol, polyether polyol, foaming agent, catalyst, and surfactant at a mixing ratio, and then performing continuous foaming with stirring at 5000 rpm under conditions of a temperature of 22-24° C. and a tank internal pressure of 3 kPa; (e) aging, for 48 hours, a foam formed after the completion of the foaming step; and (f) finishing the foam to manufacture a product.

Method of manufacturing an artificial elastic implant for restorative an reconstructive surgery

A method for manufacturing an artificial elastic implant for restorative and reconstructive surgery includes two casting steps performed in a casting mold. The mold has at least a cover that is optically and UV transparent. In a first step, a first layer of a first photo-curable material or of a second photo-curable material is cast while forming a meniscus. Using one of two photo masks, the mold is irradiated with UV light to cure the first layer. In a second step, a second layer of either the first or the second photo-curable material is cast onto the cured first layer while forming a meniscus. After irradiating the mold again with ultraviolet light, unhardened photo-curable material is removed from the product by dissolving in a suitable solvent. After additionally irradiating the product with UV light, the product is soaked, separated from the mold, placed in isopropyl alcohol and then vacuum dried.

Process For Producing Articles Formed From Polylactic Acid and Articles Made Therefrom
20170218159 · 2017-08-03 ·

PLA polymers that can be expanded into microporous articles having a node and fibril microstructure are provided. The fibrils contain PLA polymer chains oriented with the fibril axis. Additionally, the PLA polymers have an inherent viscosity greater than about 3.8 dL/g and a calculated molecular weight greater than about 150,000 g/mol. The PLA polymer article may be formed by bulk polymerization where the PLA bulk polymer is made into a preform that is subsequently expanded at temperatures above the glass transition temperature and below the melting point of the PLA polymer. In an alternate embodiment, a PLA polymer powder is lubricated, the lubricated polymer is subjected to pressure and compression to form a preform, and the preform is expanded to form a microporous article. Both the preform and the microporous article are formed at temperatures above the glass transition temperature and below the melting point of the PLA polymer.

THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY USING SAME

One embodiment of the present invention provides: a thermoplastic resin composition which contains a polycarbonate resin and a polyester resin that contains a diol unit having a cyclic acetal skeleton, and wherein the polyester resin contains specific amounts of phosphorus atoms and titanium atoms and the weight ratio of the phosphorus atoms to the titanium atoms is within a specific range; and a molded body which uses this thermoplastic resin composition.

Barrier film with enhanced formability and a method for making thereof

A film comprises an outer heat sealable layer mainly made of a (co)polyolefin with the Vicat softening temperature not exceeding 130° C., at least one heat resistant layer mainly made of at least one polar (co)polymer selected from the group including predominantly aliphatic (co)polyamides and aromatic (co)polyesters, and at least one core adhesive layer from a material capable of adhering both to (co)polyolefins and to polar (co)polymers. The heat resistant layer comprises not less than 15% of at least one predominantly aliphatic copolyamide with the melting temperature not exceeding 205° C. A method comprises the stages of coextrusion, biaxial stretching, annealing and winding up of the resulting film into a roll.

Laminated film and method for producing same
09771491 · 2017-09-26 · ·

The present invention provides a laminated film comprising a polyester film having a resin layer on at least one side thereof, wherein said resin layer contains at least metal oxide particles (A) having a number average particle diameter of 3 nm or more and 50 nm or less, and an acrylic resin (B), and a component (C.sub.1) derived from an oxazoline-based compound and/or a component (C.sub.2) derived from a melamine-based compound, and wherein said acrylic resin (B) contains a monomer unit (b.sub.1), a monomer unit (b.sub.2) and a monomer unit (b.sub.3). The present invention provides a laminated film which is excellent in transparency, suppression of interference pattern upon lamination of a high refractive index hard coat layer, adhesive property to a high refractive index hard coat layer, and adhesion under high temperature and high humidity conditions (adhesion under high temperature and high humidity conditions), at a low cost.

Active energy ray-curable resin composition, resin molded article, and method for producing resin molded article

An active energy ray-curable resin composition which contains (A) inorganic oxide particles each having an organic functional group on the surface, (B) a siloxane oligomer which has at least one functional group selected from the group consisting of a (meth)acryloyl group, an epoxy group and a vinyl group, while having a weight average molecular weight of 200-3,000, (C) a polyfunctional (meth)acrylate having a specific structure, (D) a urethane (meth)acrylate having two or more (meth)acryloyl groups in each molecule, and (E) an ultraviolet absorbent.

Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
09818665 · 2017-11-14 · ·

In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.