Provided is a dielectric composite material for a fingerprint sensor induction layer and a preparation method therefor, wherein the dielectric composite material is made from the following components: an epoxy resin, a phenolic resin, a first type of dielectric inorganic filler, a second type of dielectric inorganic filler, a curing agent, an adhesion promoter, a mould releasing agent and a flame retardant. The dielectric composite material has a high dielectric constant, a small dielectric loss, very stable dielectric properties which change very little with the test frequency, non-transparency and high hardness, such that the fingerprint sensor induction layer prepared therefrom satisfies the requirements of reliability and stability while reaching the thickness requirement, and can be used in various portable electronic products. The dielectric composite material for the fingerprint sensor induction layer is free of heavy metal lead, and is green and environmentally friendly. The dielectric composite material has convenience and high safety, and therefore the terminal application thereof can not only replace the existing digital-input password identification system, but can also be used on any electronic component in need of security.

A microchannel heat exchanger (800) is manufactured by bonding a first sheet (802a) of material and a second sheet (802b) of material in a first connection pattern for integral formation of a core portion (801) and a manifold portion (808) for the first and second sheets (802a, 802b) of material. A third sheet (802c) of material is then superposed on to the second sheet (802b) of material and bonded in a second connection pattern to the second sheet of material for integral formation of the core portion (801) and the manifold portion (808) for the second and third sheets (802b, 802c) of material. The second and third sheets (802b, 802c) of material are bonded without bonding the second sheet (802b) of the material to the first sheet (802a) of material. The core portion (801) and the manifold portion (808) of the heat exchanger (800) are thus integrally created. The interstices between the first, second, and third sheets (802a, 802b, 802c) of material are then expanded to create fluid flow channels (806). This method can also be used to create a heat sink. The bonding method may be a form of laser welding where an opaque sheet absorbs the laser energy and the heat conducts through the top sheet to the sheet immediately below, but does not cause bonding with subsequent sheets below.

A microchannel heat exchanger (800) is manufactured by bonding a first sheet (802a) of material and a second sheet (802b) of material in a first connection pattern for integral formation of a core portion (801) and a manifold portion (808) for the first and second sheets (802a, 802b) of material. A third sheet (802c) of material is then superposed on to the second sheet (802b) of material and bonded in a second connection pattern to the second sheet of material for integral formation of the core portion (801) and the manifold portion (808) for the second and third sheets (802b, 802c) of material. The second and third sheets (802b, 802c) of material are bonded without bonding the second sheet (802b) of the material to the first sheet (802a) of material. The core portion (801) and the manifold portion (808) of the heat exchanger (800) are thus integrally created. The interstices between the first, second, and third sheets (802a, 802b, 802c) of material are then expanded to create fluid flow channels (806). This method can also be used to create a heat sink. The bonding method may be a form of laser welding where an opaque sheet absorbs the laser energy and the heat conducts through the top sheet to the sheet immediately below, but does not cause bonding with subsequent sheets below.

A method of making activated carbon including: compressing a mixture of an alkali metal hydroxide, a carbon source, and a solid thermosetting polymer precursor into a pellet; and a first heating of the compressed mixture, as defined herein; and optionally crushing, washing, or both, the resulting first heated mixture, as defined herein; and optionally a second heating, as defined herein.

There is provided a joined body in which two or more members Yi including a fitting hole are fastened, in which a fastening rod including reinforcing fibers and a thermoplastic resin is positioned in the fitting hole, the fastening rod is caulked by heat, and the members Yi are caulking-fastened.

There is provided a joined body in which two or more members Yi including a fitting hole are fastened, in which a fastening rod including reinforcing fibers and a thermoplastic resin is positioned in the fitting hole, the fastening rod is caulked by heat, and the members Yi are caulking-fastened.

A method of manufacturing a core stiffened structure includes orienting the plurality of core wafers in a non-uniform pattern onto a first face sheet, the non-uniform pattern producing non-uniform spacing between adjacent core wafers; assembling a second face sheet onto the plurality of wafers; and curing an adhesive to create a bond between the plurality of wafers, the first face sheet, and the second face sheet.

A method of manufacturing a core stiffened structure includes orienting the plurality of core wafers in a non-uniform pattern onto a first face sheet, the non-uniform pattern producing non-uniform spacing between adjacent core wafers; assembling a second face sheet onto the plurality of wafers; and curing an adhesive to create a bond between the plurality of wafers, the first face sheet, and the second face sheet.

This invention relates to the production of cured polymeric skin materials. In particular, the invention relates to methods and substrates for the production of skin materials, for example, for use in building, furniture, and as architectural components for example in roofing materials such as roofing tiles, or for brick wall effect materials.

Provided is a resin molded body including: a resin porous body that contains a carbon fiber nonwoven fabric and has continuous voids; and a skin layer formed of a thermosetting resin composition. In this resin molded body, the continuous voids have a porosity of 50% by volume to 97% by volume, the skin layer has a porosity of 5% by volume or less, and the thermosetting resin composition is embedded at a depth of 50 m to 1,000 m on the resin porous body side of the resin molded body. Also provided is a method of producing a fiber-reinforced resin molded body, the method including, in the order mentioned: the preform forming step of forming a preform using a resin porous body that has continuous voids and a flexural modulus of 10 MPa or more based on the ISO178 method (1993); the sealing step of forming a closed space that encloses the preform with a molding die and/or a film; the injection step of injecting a thermosetting resin composition into the closed space; and the curing step of maintaining a temperature equal to or higher than a curing temperature of the thermosetting resin composition. This method provides a resin molded body that contains a porous structure and is excellent in surface quality and productivity.