B29K2079/08

DUAL-CURE METHOD AND SYSTEM FOR FABRICATION OF 3D POLYMERIC STRUCTURES CROSS-REFERENCE TO EARLIER APPLICATIONS
20220185962 · 2022-06-16 ·

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

METHOD FOR PRODUCING FIBER-REINFORCED PLASTIC COMBINED BODY FROM PREPREG
20220168973 · 2022-06-02 · ·

A method for producing a fiber-reinforced plastic combined body from a prepreg, includes: heating the prepreg in an atmosphere above a room temperature and lower than a curing temperature of the prepreg; provisionally combining pre-products obtained by the heating together or with another component; and retaining and curing the combined pre-products at the curing temperature or higher.

Carboxyl-group-containing aqueous resin composition and method for manufacturing polycarbodiimide compound

Disclosed is a carboxy group-containing aqueous resin composition containing a carboxy group-containing aqueous resin and a polycarbodiimide compound (X) represented by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a residue obtained by removing a functional group capable of reacting with an isocyanate from a hydrophilic compound having the functional group capable of reacting with an isocyanate; R.sup.2 represents a divalent residue obtained by removing isocyanate groups from a diisocyanate compound; R.sup.3 represents a divalent residue obtained by removing hydroxy groups from a glycol compound; X represents a group to be formed through a reaction between the hydrophilic compound and the diisocyanate compound; n1 represents a number of 1 to 10; n2 represents a number of 1 to 10; m represents a number of 1 to 5; and plural R.sup.1's may be the same or different and plural R.sup.2's may be the same or different.

LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE
20230271367 · 2023-08-31 · ·

Provided is a laminate that is useful as a temporary support for producing a large-area, high-definition, flexible electronic device, the laminate having stably low adhesive strength between a heat-resistant polymer film and an inorganic substrate even in the case of a large surface area, and having few blister defects. This laminate has an inorganic substrate, a silane coupling agent layer that includes amino groups, and a heat-resistant polymer film in the stated order, the laminate being characterized in that the elemental nitrogen component ratio in an inorganic-substrate-side peel surface after the heat-resistant polymer film has been peeled from the inorganic substrate at 90° is greater than 3.5 at % and no greater than 11 at %.

THICK POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME

A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.

HEAT RESISTANCE RESIN COMPOSITION AND INJECTION MOLDED BODY THEREOF
20230265288 · 2023-08-24 · ·

A heat resistant resin composition which does not cause stringing when performing fusion-bonding using heated plates. A heat resistant resin composition, including: a maleimide-based copolymer; and at least one resin selected from the group including: ABS resin, ASA resin, AES resin, and SAN resin; wherein: the heat resistant resin composition has a ratio G′/G″ of storage modulus (G′) to loss modulus (G″) measured in accordance with JIS K 7244-10 under conditions of 240° C. at an angular velocity of 0.63 rad/s is 0.30 or more and 1.00 or less.

SCREW ROTOR AND METHOD FOR MANUFACTURING SUCH SCREW ROTOR

A screw rotor is made out of polymer. The screw rotor includes a shaft with a rotor body on it. The polymer of the shaft is reinforced with fibers. The shaft features elements that engage the rotor body or corresponding elements on the rotor body, such that the elements prevent an axial and/or rotational movement of the shaft with respect to the rotor body.

METHOD FOR PRODUCING POLYIMIDE FILM
20220127427 · 2022-04-28 ·

A method for producing a polyimide film includes: providing a polyimide coating solution; providing a high temperature resistant polyester substrate; and coating the polyimide coating solution on the high temperature resistant polyester substrate, so that a polyimide wet coating is formed on the high temperature resistant polyester substrate; implementing a first baking step, which includes: baking the polyimide wet coating at a first temperature of between 60° C. and 130° C. to remove a part of organic solvent in the polyimide wet coating; implementing a second baking step, which includes: baking the polyimide wet coating at a second temperature of between 140° C. and 220° C. to remove a residual part of the organic solvent in the polyimide wet coating, so as to form the polyimide film on the high temperature resistant polyester substrate; and separating the polyimide film and the high temperature resistant polyester substrate from each other.

Liquid flow-path member, and manufacturing method for liquid flow-path member
11312152 · 2022-04-26 · ·

A manufacturing method for a liquid flow-path member including a flow path between a first substrate and a second substrate layered together, the method including a welding step for welding the first substrate and the second substrate together, in which in the method, the first substrate is formed of a material that blocks ultraviolet light and absorbs laser light, the second substrate is formed of a material that blocks ultraviolet light and transmits laser light, and in which the welding step includes melting, with laser light passing through the second member, a joint surface where the first member and the second member are joined to weld the first member and the second member together.

Liquid flow-path member, and manufacturing method for liquid flow-path member
11312152 · 2022-04-26 · ·

A manufacturing method for a liquid flow-path member including a flow path between a first substrate and a second substrate layered together, the method including a welding step for welding the first substrate and the second substrate together, in which in the method, the first substrate is formed of a material that blocks ultraviolet light and absorbs laser light, the second substrate is formed of a material that blocks ultraviolet light and transmits laser light, and in which the welding step includes melting, with laser light passing through the second member, a joint surface where the first member and the second member are joined to weld the first member and the second member together.