A heat-resistant release sheet of the present disclosure is a sheet formed of a single-layer heat-resistant resin film having a thickness of 35 pm or less, wherein the sheet is disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, and a heat-resistant resin forming the heat-resistant resin film has a melting point of 310° C. or higher and/or a glass transition temperature of 210° C. or higher. A use temperature of this heat-resistant release sheet can be, for example, 250° C. or higher. The heat-resistant release sheet of the present disclosure can more reliably meet a demand for an increase in thermocompression bonding temperature.

Provided is a method for preparing a carbon nanotube/polymer composite material, including: coating a nano-silicon oxide film on the surface of a porous polymer by vacuum coating; depositing a metal catalyst nano-film on the nano-silicon oxide film by vacuum sputtering; growing a carbon nanotube array in situ on the surface of the porous polymer by plasma enhanced chemical vapor deposition to obtain a carbon nanotube/polymer porous material; and impregnating the carbon nanotube/polymer porous material with a polymer and curing to obtain the carbon nanotube/polymer composite material. By using a heat-resistant polymer having a high heat-resistant temperature and a PECVD technique, a carbon nanotube array directly grows in situ on the surface of a polymer at a low temperature, which thereby overcomes the defects of the composites previously prepared, in which carbon nanotubes are difficult to be homogeneously dispersed and the interfacial bonding force in the composites is weak.

The present invention relates to 3-D structures having high temperature stability and improved micro-porosity as well as processes of making and using same. The disclosed 3-D are advantageous because they have low densities and low permittivities. When compared to previous 3-D structures, the present structures maintain their low permittivities over a broader range of electromagnetic frequencies. Thus, when used in communication devices such as array antennas, can provided higher communication performance in high temperature environments.

Provided is, a glove production method including: (1) the step of immersing a glove forming mold in a liquid coagulant containing calcium ions so as to allow the coagulant to adhere to the glove forming mold; (2) the dispersion step of leaving a dip molding composition to stand with stirring; (3) the dipping step; (4) the gelling step; (5) the leaching step; (6) the beading step; (7) the precuring step; and (8) the curing step, in which method the steps (3) to (8) are performed in the order mentioned, and the dip molding composition has a specific formulation.

A method for manufacturing a heat resistant resin composition having superior dispersibility of maleimide-based copolymer, the method including: a melt-kneading step to melt and knead a maleimide-based copolymer (A) and at least one resin (B) selected from the group consisting of ABS resin, ASA resin, AES resin, and SAN resin with an extruder; wherein: a ratio of a melt viscosity of the maleimide-based copolymer (A) with respect to a melt viscosity of the resin (B) obtained with a shear rate of 120/sec and a cylinder temperature of a kneading unit of the extruder is 1.0 or higher and lower than 3.4, is provided.

Disclosed in the present disclosure is a manufacturing method for a 3D microelectrode. The manufacturing method includes the following steps: (1) manufacturing a 3D model of a 3D microelectrode; (2) pouring a flexible material into the 3D model, and performing demolding so as to form a flexible mold having a cavity, wherein the cavity of the flexible mold can be fitted to the 3D model; (3) performing silanization treatment on the flexible mold, then pouring a flexible material into the surface of the flexible mold having the cavity, and performing demolding so as to form a flexible 3D microelectrode substrate; and (4) manufacturing a conductive layer on the flexible 3D microelectrode substrate so as to form the 3D microelectrode. In the present disclosure, a 3D microelectrode having an ultrahigh microcolumn height can be manufactured by using a 3D printing technology and a two-time mold-reversing method.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

Methods for manufacturing articles of footwear are provided. In various aspects, the methods comprise utilizing additive manufacturing methods with foam particles. In some aspects, the additive manufacturing methods comprise increasing the temperature of a plurality of foam particles with actinic radiation under conditions effective to fuse a portion of the plurality of foam particles comprising one or more thermoplastic elastomers. Increasing the temperature of the foam particles can be carried out for one or multiple iterations. The disclosed methods can be used to manufacturer articles with sub-regions that exhibit differing degrees of fusion between the foam particles, thereby resulting in sub-regions with different properties such as density, resilience, and/or flexural modulus. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

A composite wheel structure includes a single continuous fiber reinforcement layer extending axially between inner and outer ends of the wheel structure. The single fiber reinforcement layer is impregnated with different matrix materials at different axial portions of the reinforcement layer to account for specific locations where high strength or high temperature performance is needed, with other portions having different matrix materials where low temperature performance and/or low strength is sufficient. The matrix materials may be provided as separate resin films that are applied side-by-side on the single reinforcement layer, or they may be provided on a single resin film. The matrix materials may be applied to the reinforcement layer in a direct coating process. The reinforcement layer may be prepregged with the matrix materials prior to a wheel layup process, or the reinforcement layer and matrix materials may be consolidated by resin film infusion during the wheel layup process.

A photosensitive polyimide resin for ultraviolet curing-based three-dimensional printing, which is prepared from 40-60 parts by weight of an active group-containing polyimide resin; 20-50 parts by weight of an organic activator; and 2-5 parts by weight of a photoinitiator. This application further provides a method for preparing the photosensitive polyimide resin.