Provided is a heater for a ciga-like electronic cigarette with a heat transfer efficiency improved by strengthening a bonding force between a cigarette support portion and a heater portion by thermally pressing and bonding the cigarette support portion and the heater portion together using a heat-dissipating adhesive layer with a heat-dissipating filler added to a high-heat-resistant thermoplastic polyimide resin, and a method of manufacturing the same.

Provided is a heater for a ciga-like electronic cigarette with a heat transfer efficiency improved by strengthening a bonding force between a cigarette support portion and a heater portion by thermally pressing and bonding the cigarette support portion and the heater portion together using a heat-dissipating adhesive layer with a heat-dissipating filler added to a high-heat-resistant thermoplastic polyimide resin, and a method of manufacturing the same.

Methods for manufacturing articles of footwear are provided. In various aspects, the methods comprise utilizing additive manufacturing methods with foam particles. In some aspects, the disclosed methods comprise selectively depositing a binding material on foam particles in a target area such that the binding material coats at least a portion of defining surfaces of the foam particles with the binding material. The binding material is then cured to affix foam particles in the target area to one another. In various aspects, the disclosed methods can be used to manufacturer articles with sub-regions that differential levels of affixing between the foam particles, and thereby resulting in sub-regions with different properties such as density, resilience, and/or flexural modulus. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

Methods for manufacturing articles of footwear are provided. In various aspects, the methods comprise utilizing additive manufacturing methods with foam particles. In some aspects, the disclosed methods comprise selectively depositing a binding material on foam particles in a target area such that the binding material coats at least a portion of defining surfaces of the foam particles with the binding material. The binding material is then cured to affix foam particles in the target area to one another. In various aspects, the disclosed methods can be used to manufacturer articles with sub-regions that differential levels of affixing between the foam particles, and thereby resulting in sub-regions with different properties such as density, resilience, and/or flexural modulus. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

According to the present invention, a stack comprises, between a carrier substrate and a flexible substrate layer, a peeling power adjustment layer comprising polyimide, which has a refractive index higher than that of the flexible substrate layer, so that a flexible substrate can be more easily peeled from a carrier substrate layer, and thus a flexible element can be manufactured without damage to the element through a simpler process.

A method of preparing a colorless transparent copolyamide-imide resin solution and its fabrication as a thin film has been disclosed. The method details formulations derived from a reaction between one or more units of dianhydride and one or more units of diamine monomers with one or more of the monomers containing fluorine atoms in their structural unit. It enables the fabrication of thin films with superior thermal and mechanical properties along with co-efficient of thermal expansion values as low as 2 ppm/° C. and a tensile modulus as high as 9 GPa. The transparent copolyamide-imide film thus prepared has the potential for utilization in flexible displays such as substrates for thin film transistors (TFT), touch sensor panels (TSP) and cover window in organic light emitting diode (OLED) and liquid crystal display (LCD) applications.

A method for producing a microchannel bundle heat exchanger (1) includes providing a multiplicity of tubular microchannels (2); incorporating the microchannels (2) in a weaving device; interweaving the tubular microchannels (2) with a plurality of warp wires (3) in the weaving device, and generating at least one heat exchanger mat (4) from the tubular microchannels (2) which are connected to one another by means of the warp wires (3); shaping at least one heat exchanger pack (8) from the at least one heat exchanger mat (4), in particular by folding and/or rolling up the heat exchanger mat (4); and adhesively bonding the tubular microchannels (2) at two mutually opposite end sides (9, 10) of the heat exchanger pack (8).

A method for producing a microchannel bundle heat exchanger (1) includes providing a multiplicity of tubular microchannels (2); incorporating the microchannels (2) in a weaving device; interweaving the tubular microchannels (2) with a plurality of warp wires (3) in the weaving device, and generating at least one heat exchanger mat (4) from the tubular microchannels (2) which are connected to one another by means of the warp wires (3); shaping at least one heat exchanger pack (8) from the at least one heat exchanger mat (4), in particular by folding and/or rolling up the heat exchanger mat (4); and adhesively bonding the tubular microchannels (2) at two mutually opposite end sides (9, 10) of the heat exchanger pack (8).

A method for plasma treating a surface of a first substrate is disclosed. The method may comprise generating a plasma flume using a plasma treatment device having a nozzle. The plasma flume may emanate through a flume aperture of the nozzle at an emanation angle of about 5 degrees or less. The emanation angle may be defined as an angle between a central axis of the nozzle and a central axis of the flume aperture. The method may further comprise plasma treating the surface of the first substrate with the plasma flume by scanning the plasma flume over the surface of the first substrate. The first substrate may be one of a consolidated thermoplastic material and a cured thermoset material.

A method for plasma treating a surface of a first substrate is disclosed. The method may comprise generating a plasma flume using a plasma treatment device having a nozzle. The plasma flume may emanate through a flume aperture of the nozzle at an emanation angle of about 5 degrees or less. The emanation angle may be defined as an angle between a central axis of the nozzle and a central axis of the flume aperture. The method may further comprise plasma treating the surface of the first substrate with the plasma flume by scanning the plasma flume over the surface of the first substrate. The first substrate may be one of a consolidated thermoplastic material and a cured thermoset material.