A method of producing a thermoplastic liquid-crystal polymer film includes forming a thermoplastic liquid-crystal polymer film having opposite surfaces by molding a thermoplastic liquid-crystal polymer, melting the thermoplastic liquid-crystal polymer film by heating the thermoplastic liquid-crystal polymer film with the opposite surfaces being in contact with two support sheets at a temperature of from a melting point of the thermoplastic liquid-crystal polymer to a temperature higher than the melting point by 70° C., cooling the melted thermoplastic liquid-crystal polymer film to a temperature equal to or less than a crystallization temperature of the thermoplastic liquid-crystal polymer at a cooling rate of from 3° C. per second to 7° C. per second, and separating the cooled thermoplastic liquid-crystal polymer film from the support sheets.

Provided is, a glove production method including: (1) the step of immersing a glove forming mold in a liquid coagulant containing calcium ions so as to allow the coagulant to adhere to the glove forming mold; (2) the dispersion step of leaving a dip molding composition to stand with stirring; (3) the dipping step; (4) the gelling step; (5) the leaching step; (6) the beading step; (7) the precuring step; and (8) the curing step, in which method the steps (3) to (8) are performed in the order mentioned, and the dip molding composition has a specific formulation.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

A manufacturing method for a liquid flow-path member including a flow path between a first substrate and a second substrate layered together, the method including a welding step for welding the first substrate and the second substrate together, in which in the method, the first substrate is formed of a material that blocks ultraviolet light and absorbs laser light, the second substrate is formed of a material that blocks ultraviolet light and transmits laser light, and in which the welding step includes melting, with laser light passing through the second member, a joint surface where the first member and the second member are joined to weld the first member and the second member together.

A manufacturing method for a liquid flow-path member including a flow path between a first substrate and a second substrate layered together, the method including a welding step for welding the first substrate and the second substrate together, in which in the method, the first substrate is formed of a material that blocks ultraviolet light and absorbs laser light, the second substrate is formed of a material that blocks ultraviolet light and transmits laser light, and in which the welding step includes melting, with laser light passing through the second member, a joint surface where the first member and the second member are joined to weld the first member and the second member together.

A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.

A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive—polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

The present invention relates to the field of 3D printing technology, and provides a photocurable 3D printing polyimide ink, and a preparation method and application thereof. The photocurable 3D printing polyimide ink includes the following components in the following weight percentages: 40 to 60% of a photocurable polyamic acid, 5 to 40% of an organic solvent, 10 to 50% of a reactive diluent, 1 to 10% of a chain extender, and 1 to 3% of a photoinitiator. The photocurable 3D printing polyimide ink provided by the present invention has excellent mechanical properties, thermal stability, relatively high printing accuracy and relatively low shrinkage; a molded device obtained by 3D printing has excellent properties including high accuracy, great dimensional stability, high strength and corrosion resistance, excellent flexibility, high temperature resistance and relatively low shrinkage. The method for preparing the photocurable 3D printing polyimide ink has a simple process and lower energy consumption.

A method of forming a device having a compliant member includes applying heat to a thermoplastic elastomer to maintain the thermoplastic elastomer in a softened state. The thermoplastic elastomer is extruded in the softened state as a film of thermoplastic elastomer. One or more of a bobbin and a housing, each having and end, is positioned such that the end extends at least partially into the film of thermoplastic elastomer. The positioning occurs when the thermoplastic elastomer is in the softened state and/or the bobbin and/or housing is at a temperature that is greater than a temperature of the film of thermoplastic elastomer. The film is cooled so that the bobbin and/or housing are secured to the film and so that the thermoplastic elastomer is in a state that exhibits rubber-like properties.