The present invention is directed to a liquid sealant composition based on polysulphide, capable of curing on demand, and the process for preparing same, the liquid sealant composition including: (i) a polysulphide comprising an —SH end group, (ii) a crosslinking agent chosen from ethylenically unsaturated or acetylenically unsaturated compounds, the unsaturated ethylenic or unsaturated acetylenic functions of the crosslinking agent being chemically blocked with a blocking agent, and (iii) optionally, a catalyst. The present invention also relates to a process for coating a substrate with a composition according to the invention, and also to the cured sealant materials formed from this composition. Finally, the invention relates to the use of a liquid sealant composition according to the invention for the construction and/or the maintenance, and more particularly for the adhesive bonding and/or the protection, of vehicles and machines.

A method for producing a connecting part (28) uses an injection foam molding process. In a first step, a fastening part with adhesive and/or hooking elements (18), forming a component of a contact fastener, is produced and introduced into an injection mold (2) as an insert part (16). A support part (26) is formed in the mold in a second step using a foamed synthetic material (22). The support part is connected to the insert part to form the connecting part (28).

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive-polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.

A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.

A Z-pin for increasing a delamination resistance of continuous fibre-reinforced polymer composites, formed of a composite material including a polymer matrix, and a plurality of fibres embedded in the polymer matrix and aligned along the length direction of Z-pin, the fibres having an elongation at break of at least 2% and a tensile strength of at least 5 GPa, the polymer matrix having an elongation at break equal to or greater than the elongation at break of the fibres, and a tensile strength of at least 120 MPa.

A Z-pin for increasing a delamination resistance of continuous fibre-reinforced polymer composites, formed of a composite material including a polymer matrix, and a plurality of fibres embedded in the polymer matrix and aligned along the length direction of Z-pin, the fibres having an elongation at break of at least 2% and a tensile strength of at least 5 GPa, the polymer matrix having an elongation at break equal to or greater than the elongation at break of the fibres, and a tensile strength of at least 120 MPa.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

Novel aromatic polyimides, both thermoplastic and thermosettable, are disclosed based on use of asymmetric diamines and symmetric dianhydrides with either a functional endcap for further thermosetting or a non-functional endcap for retention of thermoplastic properties. Both aromatic polyimides have sufficient physical properties to be useful in 3D printing.

A method for preparing a pre-bond surface of a composite structure includes the steps of: (1) separating a peel ply, co-cured with a composite substrate, from the composite substrate; and (2) transferring an identifiable marking agent from the peel ply to the composite substrate upon separation of the peel ply from the composite substrate. Residue of the peel ply, transferred from the peel ply to the composite substrate upon separation of the peel ply from the composite substrate, is layered on the identifiable marking agent.