A pre-stressed curved plate comprising a curved plate having at least one concave surface, the curved plate being enveloped and adhesively bonded with tensioned reinforcing fibers, whereby the reinforcing fibers are first wound around the plate under tension being spaced apart from the concave surface and subsequently subjected to pressure to stretch and bond the reinforcing fibers to the surfaces of the plate, where upon bonding, the tensile strain of the fiber introduces stress in the plate.

A pre-stressed curved plate comprising a curved plate having at least one concave surface, the curved plate being enveloped and adhesively bonded with tensioned reinforcing fibers, whereby the reinforcing fibers are first wound around the plate under tension being spaced apart from the concave surface and subsequently subjected to pressure to stretch and bond the reinforcing fibers to the surfaces of the plate, where upon bonding, the tensile strain of the fiber introduces stress in the plate.

An extrudate transport apparatus comprises a free floating roller assembly, wherein the roller assembly controls a rotational pitch of a cylindrical green ceramic extrudate as the green ceramic extrudate moves longitudinally from a first location to a second location within the extrudate transport apparatus. The free floating roller assembly has a predetermined effective weight and comprises a contact roller having a deformable outer surface for frictionally contacting an outer surface of the green ceramic extrudate in motion adjacent thereto, while maintaining a constant contact force upon said green ceramic extrudate.

Fan blade containment system includes circular tile layer of annular ceramic tiles attached to and extending radially inwardly from a shell, radially inner and outer annular surfaces of ceramic tiles bonded to a radially inner composite layer and the shell respectively with elastomeric inner and outer adhesive layers respectively. Elastomeric adhesive layers between circumferentially adjacent overlapped or scarfed edges along circumferential edges of the ceramic tiles overlap and mate along oppositely facing surfaces of adjacent ones of the ceramic tiles. Inner and outer adhesive layers and elastomeric adhesive layer may be a double-sided adhesive foam tape. Scarfed edges may be bevels or rabbets. Shell may be made of a metal or composite material. Fan blade containment system may be bonded to and extend inwardly from fan case circumscribing fan blades of a fan. Inner composite layer and composite outer shell may be co-cured with ceramic tiles therebetween.

A method of forming a thermoplastic cellular structure includes positioning a lower surface of a trough of a first corrugated thermoplastic sheet against an upper surface of a crest of a second corrugated thermoplastic sheet; positioning a support against a lower surface of the crest of the second corrugated thermoplastic sheet; and pressing a thermoplastic welding element against an upper surface of the trough of the first corrugated thermoplastic sheet so that at least a portion of the lower surface of the trough of the first corrugated thermoplastic sheet melts and bonds to at least a portion of the upper surface of the crest of the second corrugated thermoplastic sheet.

A method of forming a thermoplastic cellular structure includes positioning a lower surface of a trough of a first corrugated thermoplastic sheet against an upper surface of a crest of a second corrugated thermoplastic sheet; positioning a support against a lower surface of the crest of the second corrugated thermoplastic sheet; and pressing a thermoplastic welding element against an upper surface of the trough of the first corrugated thermoplastic sheet so that at least a portion of the lower surface of the trough of the first corrugated thermoplastic sheet melts and bonds to at least a portion of the upper surface of the crest of the second corrugated thermoplastic sheet.

A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

According to one example, a ceramic housing for an electronic device includes a surface and an elastomer, where the elastomer covers from ten percent to eighty-five percent of a total surface area of the surface.

A patch may be used to rework a composite structure in the field. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer.

A patch may be used to rework a composite structure in the field. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer.