Systems and methods for using a non-stick conductive material to automate tool touch-off in an additive manufacturing process are provided. A substrate comprises a first conductive layer, an intermediate binder layer, and a second non-stick conductive layer. The non-stick conductive layer may comprise perfluoroalkoxy alkanes and carbon nanotubes. An electrical connection may be made between the first conductive layer and the second non-stick conductive layer. When used with an additive manufacturing device, when the nozzle of the device contacts the substrate, a circuit may close resulting in a detectable voltage drop. When the voltage drop is detected, a reference point for the additive manufacturing device may be set.

An apparatus and method for making a three-dimensional object from a solidifiable material using a linear solidification device is shown and described. The apparatus includes a solidification substrate that is tiltable relative to a film about a tilting axis. Layers of the solidifiable material solidify in contact with a film located between the most recently solidified object layer and a solidification substrate that comprises the solidification substrate assembly. The tilting of the solidification substrate relative to the film allows the substrate to be used to squeeze excess solidifiable material from between the film and the most recently solidified object surface while minimizing or eliminating the formation of bubbles in the solidifiable material which can prolong object build times. In addition, tilting the solidification substrate before separating an adhered object surface from the film breaks any vacuum formed between the substrate and the film which reduces the forces involved in separating the object form the film.

A solidification substrate assembly for making a three-dimensional object from a solidifiable material includes a solidification substrate assembly. In certain examples, the solidifiable material solidifies in contact with the solidification substrate, and the tilting of the substrate and/or or the use of a peeling member facilitates separation of the substrate from the solidified material. In other examples, the solidification substrate assembly includes a film that is adjacent to a rigid or semi-rigid layer. The solidifiable material solidifies in contact with the film, and a peeling member peels the film away from the solidified material. Intelligent solidification substrate assemblies are also described in which a force sensor determines when to expose the solidifiable material to solidification energy and/or whether to use a peeling member to separate the solidification substrate from a solidified objection section.

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquid contacting the build surface, (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, wherein the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface while concurrently filling the subsequent build region with polymerizable liquid as in step (b). Apparatus for carrying out the method is also described.