A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

A sensor module contains a sensor unit, a sensor cover, and a main body. The sensor unit has a sensor surface and a base surface. The sensor cover covers the sensor surface and at least a section of the base surface. The sensor cover is connected to the base surface and/or the main body by a fused connection. The main body is connected at least to the base surface of the sensor unit by a fused connection with a selectable relative position in relation to the sensor cover. Pre-mounting of the sensor unit in a sensor cover and advantageous encapsulation of a sensor can thus be achieved.

Provided are molds for polar anisotropic ring-shaped bonded magnet molded articles which enable the production of bonded magnet molded articles with a high degree of roundness and only slight distortion, without the need for mold modification and preparation of a test mold, and a method of preparing such molds. The present invention relates to a method of preparing a mold for a polar anisotropic ring-shaped bonded magnet molded article, the method including: 1) determining the shrinkage length (Tc) of a desired polar anisotropic ring-shaped bonded magnet molded article using the following equation: Tc=Tx(1/1002/100); 2) determining the radius (Dm) of a magnetic pole portion of a mold cavity using the following equation: Dm=D/(12/100); and 3) defining the outer peripheral shape of the mold cavity from the Tc, the Dm, and the number (P) of magnetic poles of the molded article.

The present invention relates to a triboelectric energy harvesting device and a method for manufacturing the same. The triboelectric energy harvesting device according to an embodiment of the present invention includes a first frictional layer provided with a first surface having first electron affinity, and a second frictional layer facing the first surface and having second electron affinity, wherein at least one of the first and second frictional layers is formed of an elastic material and is provided in an elastic structure.

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Methods and systems for producing a structure having selectable piezoelectric properties via additive manufacturing. Such methods can include coupling an ultrasound generating device to a print head of the additive manufacturing apparatus; transmitting acoustic energy from the ultrasound generating device to the print head to vibrate the print head in an oscillatory manner; extruding a feed material from the print head; moving the print head in at least one dimension relative to a substrate on which the structure is being manufactured; and dispensing layers sequentially on top of each other to form the structure. Such systems can include an additive manufacturing apparatus comprising a print head movable in at least one dimension relative to a base configured to support the structure being produced; and an ultrasound generating device that is connected to the print head.

A process for manufacturing a rubber patch comprising a radiofrequency transponder, the patch having a first layer and a second layer, the method comprising moulding and vulcanizing a first layer, the exterior surface of which comprises a cavity able to receive a radiofrequency transponder, placing a transponder in the cavity, and then placing and vulcanizing a second layer in order to embed the transponder between the two layers.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

A package delivery apparatus uses an unmanned aerial vehicle (UAV) to deliver a package containing a product to a delivery destination area. The UAV uses GPS signals to guide it to the delivery destination area and an altimeter to determine its height above the delivery destination area. The UAV then adjusts its height to a preferred drop or release height for that package and product and releases the package. An optional camera allows a human operator to view the delivery destination area. An expandable foam package surrounds the product to protect the product from impact and moisture. The package may be streamlined to reduce air resistance and increase the range of the UAV. The package characteristics, such as its thickness, are determined based one or more of the weight and fragile nature of the product, and the drop height.