The present invention relates to an integrated process for the production of polyester tape, comprising the steps of a) preparing feed polyester comprising a polymerisation reaction in one or more reactors in series and measuring the viscosity of the obtained feed polyester, b) feeding the feed polyester obtained from step a) and optional additives to a melt mixing device, mixing said feed polyester and said optional additives so as to form a molten polyester composition and measuring the viscosity of the obtained polyester composition, c) extruding the molten polyester composition through a film extrusion die thereby forming a molten film of said polyester composition, d) preparing a polyester tape from said molten polyester film, said preparing comprising trimming the edges of the film at a stage where said film is below its melting temperature, e) feeding at least a part of the trimmed edges obtained in step d) in-line to the melt mixing device in step b) wherein the amount of trimmed edges and optional further additives fed to the melt mixing device in step b) is controlled on the basis of the measured viscosity of the polyester composition.

There is provided a polyolefin resin foam sheet having a plurality of cells which is formed by foaming a polyolefin resin, wherein, in the polyolefin resin foam sheet, the average cell sizes and the maximum cell sizes in the MD direction and the TD direction are each a predetermined value, and a ratio [TD strength at break/MD average cell size] and a ratio [MD strength at break/TD average cell size] are both 80 kPa/μm or more.

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Injection molded parts with a small dimension that exhibit high heat resistance are described. Thermoplastic compositions that can be utilized to form the injection molded parts are described. The thermoplastic composition includes a polyarylene sulfide and a crosslinked impact modifier. The thermoplastic composition can also include siloxane polymers, thermoplastic elastomers, or other additives that can further improve the characteristics of the injection molded parts.

A cross-head die assembly for use with an extruder is described. The cross-head die assembly includes: an inlet section having an inlet for communicating flow from the extruder to one or more flow channels formed in a support block; and an outlet, a removably mounted die located at the outlet and in fluid communication with the one or more flow channels; said support block further comprising an interior slot extending from a first side of the support block to an outlet passageway; a removable cassette positioned in the interior slot, wherein the front end of the removable cassette is positioned to seal the outlet passageway of the slot so that the slot is isolated from the flow.

The invention presented in this document relates to processes for the preparation of a formulation containing poly(lactic acid) (PLA) and aliphatic and/or aromatic polyesters which plasticize it, and its use in monofilaments and films. The presence of polyesters does not remove the biodegradability and composting characteristics of the raw materials used in the formulation. The invention also concerns products that use the formulation.

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

An insulating resin composition that allows a reduction in the amount of spatial electric charges accumulated in an insulating layer, whereby dielectric breakdown is less likely to occur. This insulating resin composition 1 contains at least an antioxidant and a base resin including an unmodified polyolefin resin and a modified polyolefin resin modified by a molecule having a polar group. The modified polyolefin resin is modified by at least one selected from unsaturated dicarboxylic anhydride derivatives, unsaturated dicarboxylic anhydrides, and unsaturated dicarboxylic acids, which are each a molecule having a polar group. The base resin has a so-called island-in-sea structure in which a second phase 12 containing the modified polyolefin resin is present in a first phase 11 containing the unmodified polyolefin resin. The second phase has an average diameter of 2 μm or less.

The present invention relates to the technical field of wire-rod production equipment, in particular relates to an automatic production line for conductive tape and a manufacturing method for conductive tape, Automatic production of conductive tape brings about high production efficiency and low cost; it not only conducts pretreatment and corresponding detections of the conductors in the production process but also conducts follow-up treatment and corresponding detections of the conductive tape and thus improves the production quality of the conductive tape; in addition, it marks the abnormality position of the conductive tape which is abnormal during the withstand voltage detection so that the operator can accurately find out the abnormal section of the conductive tape.

A binding machine comprising: —a feeding device for feeding a binding element (3) in the form of a wire or strap in a loop around one or more objects to be bound and subsequently retracting the binding element to draw it tightly around said objects; and—a laser welding device for forming a welded joint between a section at the leading end of the binding element and an adjoining section at the trailing end of the part (3a) of the binding element fed in a loop around said objects to thereby secure this part of the binding element in a loop around the objects. The laser welding device is configured to cut off the binding element at said trailing end to thereby release said part (3a) of the binding element from the remaining part (3b) of the binding element.