A method and apparatus for forming a radius filler. A lattice is formed of connecting elongate members having a three-dimensional shape of the radius filler. A resin is placed within the lattice.

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.

The invention generally relates to intermediate layers (shim-type stacked foils/films) as adjusting elements for mechanical structures.

A plastics container of modular construction includes a first plastics segment and a second plastics segment. The first and second plastics segments are connected to one another by plastics welding. At least one of the first and second plastics segments has a paintable surface layer on an outer side thereof or is comprised of a paintable material.

Devices (102) formed using additive manufacturing are disclosed. In one arrangement, a device comprises at least one non-planar layer (104) formed of a plurality of filaments. The device has one or more functional elements (108). Each functional element comprises an electrically conductive element, an optical fibre or a hollow tube. A portion of each functional element is embedded in and geometrically conforms with one of the non-planar layers, or is arranged between and geometrically conforms with two of the non-planar layers.

The present invention is directed to a biaxially oriented polypropylene (BOPP) film with improved breakdown strength and to a capacitor comprising an insulation film comprising a layer of the biaxially oriented polypropylene film of the present invention. The present invention is further directed to a process for producing a biaxially oriented polypropylene film. Finally, the present invention is further directed to the use of a biaxially oriented polypropylene film of the present invention as layer of an insulation film of a capacitor. The BOPP film comprises a polypropylene composition, wherein the polypropylene composition comprises a high isotactic homopolymer of propylene and a polymeric -nucleating agent. The BOPP film has a dielectric breakdown field strength Eb63.2 of at least 595 kV/mm. The process for producing a biaxially oriented polypropylene film comprises the steps of extruding a polypropylene composition to a flat film and orienting the flat film simultaneously in the machine direction and in the transverse direction.

Systems and methods in accordance with embodiments of the invention operate to structurally interrelate two components using inserts made from metallic glass-based materials. In one embodiment, a method of structurally interrelating two components includes: forming an insert from a metallic glass-based composition; where the formed insert includes a metallic glass-based material; affixing the insert to a first component; and structurally interrelating the second component to the first component using the insert.

An objective of the present invention is to provide a film to hold a metal layer, a metallic decorative sheet intermediate product, a metallic decorative sheet, a metallic molded product, and a method for producing a metallic molded product which prevent the occurrence of the whitening phenomena or the like of the metallic molded product which occur during production of the metallic molded products by using a metallic decorative sheet, as well as enables molding in a wider temperature range. A film to hold a metal layer comprises a thermoplastic resin having a melting point of 230 C. to 250 C. is provided, wherein the film to hold a metal layer has transparency.

There is disclosed a sealable, flexible membrane for encapsulating a part to be isostatically pressed at an elevated temperature. The membrane includes at least one first layer of polymeric film having a melting point above the elevated temperature, and at least one second layer disposed on the first layer. The second layer comprising a metal. In one embodiment, the metal comes into contact with the part to be isostatically pressed. The membrane, which typically has a thickness ranging from 10 to about 500 m, and is impermeable to the flow of liquids and gases when sealed, can be used to warm press parts up to about 350 C. and pressures ranging from 5,000 psi to 100.000 psi. Methods to isostatically press parts using this sealable, flexible membrane are also disclosed. Bags made from the sealable, flexible membrane that are used in isostatic presses are also disclosed.

A releasable adhesive connection between two joint partners, which are materially bonded to one another by means of an adhesive, wherein the adhesive connection is releasable in a separating process by an introduction of heat. According to the disclosure, the introduction of heat is performed using a heated thermofluid. A first joint partner comprises at least one fluid chamber, which is filled at least in the separating process using the thermofluid and which indirectly or directly adjoins the adhesive with a chamber wall, so that in the separating process, the introduction of heat into the adhesive takes place by means of heat conduction from the thermofluid via the chamber wall into the adhesive.