A multilayered article for laser marking can comprise: a first layer having a visible transmission of greater than or equal to 80%; a second layer having a visible transmission of greater than or equal to 80%, and wherein the second layer comprises an active component that will form a laser mark with an L* of less than or equal to 40, when exposed to a laser light of a wavelength of greater than 800 nm; a third layer reflective to laser light having a wavelength greater than 800 nm, wherein the third layer has a visible transmission of greater than or equal to 80%; and optionally a substrate; wherein the article comprises a laser mark having an L* of less than or equal to 40 as measured according to CIELAB 1976 (specular included).

According to one embodiment, a memory card includes a first case including a first surface, the first surface including a groove, and the first case including a recessed area, a second case including a second surface, the second case being bonded to the first case, a memory disposed between the first case and the second case, a write-protect switch disposed between the first case and the second case and disposed in the recessed area, and a first director disposed between the first case and the second case, the first director being provided along an edge portion of the first case or the second case excluding the recessed area.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.