Patent classifications
B29L2031/18
Thermally conductive sheet and method for producing thermally conductive sheet
A thermally conductive sheet having good thermal conductivity in the thickness direction and a method for producing a thermally conductive sheet. A thermally conductive sheet having a surface with an L* value in a L*a*b color system of 29 or more and 47 or less is obtained by preparing a thermally conductive composition comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, extrusion-molding the thermally conductive composition to obtain a columnar cured product, and cutting the columnar cured product in a direction almost perpendicular to a length direction of a column to a predetermined thickness.
HEAT EXCHANGER COMPONENT WITH EMBEDDED SENSOR
An additively manufactured component is provided. The additively manufactured component includes an additively manufactured first part defining a first trench, an additively manufactured second part defining a second trench and a fiber optic sensor. The additively manufactured first and second parts are additively manufactured together with the first and second trenches corresponding in position such that the additively manufactured first and second parts form an assembled part with a fiber channel cooperatively defined by the first and second trenches. The fiber optic sensor includes a first sensor part embedded in the fiber channel and a second sensor part operably coupled to the first sensor part and extendible at an exterior of the assembled part.
A PROCESS FOR PRODUCING A HIGH-HEAT DELIVERY DEVICE OBTAINING OR CONSISTING OF A POLYMER COMPOSITION COMPRISING A FRAGRANCE, OR A PART THEREOF
A process for producing a heat delivery device containing or consisting of a polymer composition comprising a fragrance or part thereof comprising the steps of: a) producing a first polymer composition, by feeding a thermoplastic polyester, optionally a first thermoplastic copolyester elastomer and optionally further components of the composition to an extruder, melting and mixing the components, b) cooling down the first polymer composition and c) feeding the first polymer composition and a master batch comprising a second thermoplastic copolyester elastomer and the fragrance to an injection molding machine, melting and mixing the first polymer composition and the master batch in the injection molding machine to obtain the second polymer composition and injection molding of the so obtained molten second polymer composition into the mold of the high-heat delivery device or the part thereof.
MANUFACTURE OF A THERMOPLASTIC HEAT EXCHANGER
A method for manufacturing a thermoplastic heat exchanger for a battery module is provided. The method includes extruding a battery interface portion comprising a first thermoplastic composition and having a battery interface surface and a chamber surface opposite the battery interface surface; injection molding a base portion comprising a second thermoplastic composition having a channeled surface defining a plurality of channels and an outer surface opposite the channeled surface. The battery interface portion and the base portion are melt-bonded such that the chamber surface cooperates with the plurality of channels of the channeled surface to define a flow chamber for circulation of a thermal cooling fluid within the thermoplastic heat exchanger.
HEAT STAKE AND METHOD OF ELIMINATING HEAT STAKE SINK MARKS IN A PLASTIC PART
A heat stake for a plastic part includes a body having a proximal end, a flared section and a distal end. The proximal end has a first cross-sectional area A.sub.1 and the flared section has a second cross-sectional area A.sub.2 where A.sub.1<A.sub.2. The distal end has a dual taper. That plastic part incorporating the heat stake is also disclosed.
Shape memory thermal interface materials
A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.
CARBONOUS MATERIALS FOR RADIO FREQUENCY HEATING IN REACTION SYSTEMS
A system may include a container configured to receive at least one substance. A system may include a heating assembly configured to heat the at least one substance, the heating assembly comprising. A system may include a plurality of electrodes, a power source connected to the plurality of electrodes, wherein an electrical field between the plurality of electrodes is created by providing power to the plurality of electrodes; and one or more heat-dispersing bodies are dispersed in the at least one substance, the one or more heat-dispersing bodies comprising: a polymer material; and a carbonous material dispersed in the polymer material, the carbonous material configured to generate heat within the container responsive to the electrical field between the plurality of electrodes.
Heat exchanger expanded overlap joint
A furnace heat exchanger assembly includes first and second heat exchanger halves. The first heat exchanger half includes a first half of an exhaust channel and an inner joint flange half at an end thereof. The second heat exchanger half includes a second half of the exhaust channel and an outer joint flange half at an end thereof having first and second capturing tabs. The first and second heat exchanger halves are coupled together such that the first and second capturing tabs substantially overlap the inner joint flange half to form a joint flange.
SHAPE MEMORY THERMAL INTERFACE MATERIALS
A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.
METHOD FOR CONNECTION OF PLASTIC FITTINGS IN A COOLANT VALVE SYSTEM
A method for connection of fittings together as well as a fitting connection are provided. The fitting connection includes first and second fitting parts. The first fitting part has an external circumferential groove, and the second fitting part has at least one circumferential slot located in the wall aligned with the external circumferential groove in an assembled position of the first and second fitting parts. At least one flow hole extends from a sealing space defined between the external circumferential groove and the at least one circumferential slot to an exterior of at least one of the first fitting part or the second fitting part. A curable liquid material is injected through the flow hole into the sealing space defined between the external circumferential groove and the slot. Once cured, the liquid material forms a sealed, form-locked connection between the first and second fitting parts.