According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.

An imprint apparatus includes a deforming mechanism for deforming a pattern region of a mold, and performs, after first processing for applying a first deformation amount, second processing for curing an imprint material in a state where the imprint material and the pattern region are in contact with each other and where a second deformation amount is given to the mold by the deforming mechanism to reduce an overlay error between each shot region and the pattern region. A magnitude relation between a driving force of the deforming mechanism required to set a deformation amount of the mold to the first deformation amount and a driving force of the deforming mechanism required to set the deformation amount of the mold to the second deformation amount varies depending on a magnitude of the driving force of the deforming mechanism for setting the deformation amount to the second deformation amount.

A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

The present invention provides an imprint apparatus that forms a pattern of an imprint material on a substrate using a mold, the apparatus comprising: a supplier configured to supply the imprint material as a plurality of droplets onto the substrate; and a controller configured to control the supplier based on information indicating a target arrangement of the imprint material to be supplied as the plurality of droplets onto a predetermined region of the substrate, wherein the plurality of droplets in the target arrangement include a first droplet group including a plurality of first droplet arrays, a second droplet group including a plurality of second droplet arrays, and a third droplet array.

A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.

Systems and methods for printed multifunctional skin are disclosed herein. In one embodiment, a method of manufacturing a smart device includes providing a structure, placing a sensor over an outer surface of the structure, and placing conductive traces over the outer surface of the structure. The conductive traces electrically connect the sensor to electronics.

A touch input device and a method for manufacturing the same are disclosed. The touch input device includes: a first base including a metal compound; a first pattern groove formed over one surface of the first base; a first sense pattern formed over the first pattern groove and including a conductive material; a second base stacked over the first base, and configured to include a metal compound; a second pattern groove formed over one surface of the second base; a second sense pattern formed over the second pattern groove, including a conductive material, and spaced apart from the first sense pattern; and a line unit connecting the first sense pattern and the second sense pattern to an integrated-circuit.

A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

A method for conveying a substrate from a first to a second apparatus is provided. Material is applied to the substrate when on the first apparatus. A substrate conveyance apparatus including first and second holding portions is used. As a first step, the substrate is transferred from a first apparatus placement surface to the substrate conveyance apparatus. The substrate is then conveyed from the first apparatus to the second apparatus. The substrate is then transferred from the first holding portion to the second apparatus. In the first step, raising the first holding portion in a state where the first holding portion is inserted in a space under the substrate causes the first holding portion to hold the substrate, and the second holding portion to hold a protection member by holding a holding and receiving portion provided on a protection member surface opposite to a protection member surface facing the substrate.