A mold for encapsulating an electrical component. The mold includes an encapsulation chamber and an air inlet. The encapsulation chamber is defined by a housing, an open top, and a solid bottom. The housing includes a solid outer wall, a permeable inner wall, and an air chamber between the solid outer wall and the inner wall. The air inlet is configured to introduce a gas into the air chamber. The encapsulation chamber is sized and shaped to receive the electrical component while leaving a gap for the introduction of encapsulant around the electrical component. The encapsulant may be silicone rubber. To remove an encapsulated electrical component, pressurized air may be introduced through the air inlet into the air chamber, passing through the permeable inner wall, separating the outer surface of the encapsulant from the housing, and allowing the combination casting to be removed from the mold.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.

A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

In a method for printing a three dimensional structure, a continuous length of fiber that includes, interior to a surface of the fiber, a plurality of different materials arranged as an in-fiber functional domain, with at least two electrical conductors disposed in the functional domain in electrical contact with at least one functional domain material, is dispensed through a single heated nozzle. After sections of the length of fiber are dispensed from the heated nozzle, the sections are fused together in an arrangement of a three dimensional structure. The structure can thereby include a continuous length of fiber of least three different materials arranged as an in-fiber functional device, with the continuous length of fiber disposed as a plurality of fiber sections that are each in a state of material fusion with another fiber section in a spatial arrangement of the structure.

An electrostatic separation device (is for a mixture of granules of different materials. The device includes a separation chamber having an inlet and delimiting an inner volume and a collection device for granules placed in the inner volume, opposite the inlet. At least two pairs of electrodes are successively placed in the elevation direction in the inner volume, between the inlet and the collection device. Each pair includes an anode and a cathode, placed on either side of a central axis extending in the elevation direction. At least one generating system is suitable for applying a difference in electric potential between the anode and the cathode of each pair.

A transferring assembly for transferring onto an object a RFID identification device consisting of a microchip connected to an antenna made of electrically conductive material, wherein a film of adhesive material is applied to a supporting element, the microchip is applied on the film of adhesive material in a zone of the supporting element, the antenna is formed by applying the wire made of electrically conductive material to the film of adhesive material and electrically connecting the antenna to the microchip, and the zone is pressed against a surface of the object, with the RFID identification device facing the surface, the adhesive material, and/or the supporting element, being chosen so that the adhesive material has an adhesiveness on the surface of the object that is significantly greater than the adhesiveness of the film on the supporting element.

Provided is a liquid metal-based flexible electronic device and a method for preparing a liquid metal-based flexible electronic device, that includes: preparing an Acrylonitrile Butadiene Styrene (ABS) plastic model; performing an ion sputtering on a surface of the ABS plastic model to form a gold film, to obtain a gold-plated ABS circuit; introducing a first silica gel into a mold to suspend the gold-plated ABS circuit inside the mold, and curing the first silica gel to obtain a cured model; immersing the cured model in acetone to dissolve the ABS model, to obtain a microchannel with a gold plating on an inner wall of the microchannel in a first silica gel substrate; and injecting a gallium-indium eutectic, inserting a copper wire, and applying a second silica gel and curing the second silica gel, to obtain the liquid metal-based flexible electronic device.

A resin molding apparatus capable of suppressing an occurrence of defects related to resin filling. The resin molding apparatus includes: a molding mold which forms a cavity; a pot which is arranged in the molding mold and is capable of accommodating a resin material, and in which an opening portion opening directly to the cavity is formed; and a plunger which is arranged to be slidable in the pot, and transfers the resin material accommodated in the pot toward the cavity via the opening portion by extruding the resin material. An inner diameter of the opening portion is formed to be the same as an outer diameter of the plunger or larger than the outer diameter of the plunger.

The present invention is a film capacitor comprising a dielectric film and a metal layer, the dielectric film being a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, and the resin film having a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200° C. for 10 minutes, a loss tangent (tanδ) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00. The present invention provides a film capacitor that includes a resin film as a dielectric film, the resin film exhibiting excellent heat resistance, excellent withstand voltage properties, and excellent workability.