The present invention provides an apparatus for use in mixing and dispensing a curable fluid stream (stream) into an open mold to fill the mold to make polishing pads for chemical mechanical planarization of substrates. The apparatus comprises an actuator frame on which is mounted (i) a set of two plates releasably attached to the actuator frame and adapted to cut the stream when the mold is full and to release from the actuator frame after cutting the stream, and (ii) a dispenser unit for continuous pouring of the stream into an open mold, the apparatus adapted to enable removal of the released plates from the actuator during the continuous pouring after the mold is full, e.g. by raising the actuator frame and the (ii) dispenser unit, whereby one can place a container above the mold to catch the plates.

An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surface, and an offset surface between an edge of the working surface and an upper edge of the channel surface. The microstructured working surface includes a plurality of microstructures. Tops of the plurality of microstructures define a top plane and bases of the plurality of microstructures define a base plane. The substantially vertical channel surface defines a wall of a channel of the plurality of channels and the channel surface defines a channel plane. The offset surface includes a nonplanar portion of displaced material. The displaced material defines a displacement plane that is below the base plane or within a tolerance of the top plane.

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.

A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

The present invention relates to a method for producing a resin sheet containing at least the following step P, Step P: a step of applying pressure (p) to a sheet-shaped resin modeled article formed by a 3D printer while heating, and deforming the sheet-shaped resin modeled article to obtain a compressed sheet; and relates to a polishing pad containing a polishing layer obtained by using the method for producing.

An environment-friendly polishing disc is manufactured by a processing technology that includes: preparing a table, drying oven, cutting tools, upper and lower molds, polishing powder, a batching barrel, and a polyurethane synthetic resin comprising HC8968 and HC8552; cutting a polyester-fiber upper backsheet and a lower backsheet to match the mold profile; batching the polishing powder with the polyurethane resin and uniformly mixing with a vibrator; pouring the mixture into the lower mold over the lower backsheet, scraping the surface, overlaying the upper backsheet, and clamping with the upper mold; sequentially drying the clamped assembly at about 45 C. for about 230 min, about 92 C. for about 230 min, and about 60 C. for about 450 min; and removing the molds to form the disc. An optional central notch may be provided. The process reduces external polishing consumables and supports uniform soft-layer formation.

A method includes providing a photoreactive 3D printing system (PRPS). An application-specific substrate is positioned in a holding device of the PRPS. Content is printed on the application-specific substrate. The content and the application-specific substrate are incorporated in a finished product after the printing. A method includes providing a PRPS. A global substrate is positioned in a holding device of the PRPS. A feature is printed on the global substrate. An application-specific substrate is positioned on the global substrate according to the feature. Content is printed on the application-specific substrate. The content and the application-specific substrate are incorporated in a finished product after the printing.

A polishing pad for chemical mechanical polishing comprises a polishing layer which comprises a polymer matrix which is the reaction product of an isocyanate terminated oligomer or polymer, with a curative blend comprising two or more polyamine curatives wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such expansion occurring during reaction of the isocyanate terminated oligomer or polymer with the two or more curatives, wherein the polishing layer is characterized by one or more of a ratio of viscous modulus (G) at 104 C. to shear loss modulus (G) at 150 C. of at least 5:1; and a specific gravity of the polishing layer is less than or equal to 95% of a calculated specific gravity for the isocyanate terminated oligomer or polymer, the curative blend and the pre-expanded fluid filled polymeric microspheres.