Methods, systems, and devices for manufacturing of a wearable ring device are described. Generally, the techniques described herein may support a manufacturing process that reduces manufacturing complexities and deformities. For example, a deformable band may be positioned (e.g., by a manufacturing system) through an inner circumference of an inner housing of a wearable ring device. The manufacturing system may stretch the deformable band to create tension across at least a portion of the inner housing member, the tension including at least axial tension across one or more cutouts in the inner housing member. Accordingly, the manufacturing system may inject a fillable material through an opening in the wearable ring device, such that the fillable material fills a cavity between the inner housing member and an outer housing member of the wearable device and fills the one or more cutouts, contacting the deformable band, without further deforming the deformable band.

A method including the selection of a piece of jewelry with a setting, and inserting a mixture of transparent resin and cremation ashes in the setting.

Methods, systems, and devices for manufacturing of a wearable ring device are described. The method includes coupling a printed circuit board (PCB) to an inner shell, surrounding the inner shell and the PCB with an outer shell, disposing a first molding plate against a first lateral side of the wearable ring device, and filling at least a portion of a cavity of the wearable ring device with a filler material. The method further includes performing a first curing procedure to form a first molded side cover on the first lateral side of the wearable ring device, where the first curing procedure cures a first portion of the filler material. The method further includes performing a second curing procedure to form a second molded side cover on a second lateral side of the wearable ring device, where the second curing procedure cures a second portion of the filler material.

Methods, systems, and devices for manufacturing of a wearable ring device are described. Generally, the techniques described herein may support a manufacturing process that reduces manufacturing complexities and deformities. For example, a deformable band may be positioned (e.g., by a manufacturing system) through an inner circumference of an inner housing of a wearable ring device. The manufacturing system may stretch the deformable band to create tension across at least a portion of the inner housing member, the tension including at least axial tension across one or more cutouts in the inner housing member. Accordingly, the manufacturing system may inject a fillable material through an opening in the wearable ring device, such that the fillable material fills a cavity between the inner housing member and an outer housing member of the wearable device and fills the one or more cutouts, contacting the deformable band, without further deforming the deformable band.

Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with the plurality of apertures. The method may also include coupling an outer ring-shaped housing to the inner ring-shaped housing by surrounding the inner ring-shaped housing with the outer ring-shaped housing. Additionally, the method may include injecting a filler material through an additional aperture of the outer ring-shaped housing to fill a cavity defined by the inner ring-shaped housing and the outer ring-shaped housing, filling at least a portion of the plurality of the inner ring-shaped housing with the filler material.

Methods, systems, and devices for manufacturing a wearable ring device are described. The manufacturing assembly may rotate, by a rotational component, an inner housing member of the wearable ring device to a radial orientation based on an optical alignment process. A positioning component of the manufacturing assembly may insert and align an optical component of a flexible circuit assembly into at least one aperture of the inner housing member by moving the flexible circuit assembly from a first position adjacent to the inner housing member to a second position on the inner housing member. The manufacturing assembly may secure one or more edges of the flexible circuit assembly onto the inner housing member using a plurality of arms of the positioning component and apply, by an automatic adhesive dispensing device of the manufacturing assembly, a polymeric material to adhere the flexible circuit assembly to the inner housing member.

Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with the plurality of apertures. The method may also include coupling an outer ring-shaped housing to the inner ring-shaped housing by surrounding the inner ring-shaped housing with the outer ring-shaped housing. Additionally, the method may include injecting a filler material through an additional aperture of the outer ring-shaped housing to fill a cavity defined by the inner ring-shaped housing and the outer ring-shaped housing, filling at least a portion of the plurality of the inner ring-shaped housing with the filler material.