B29L2031/744

Machine direction oriented film for labels
09802394 · 2017-10-31 · ·

Machine direction oriented multilayer film suitable for preparing labels, comprising a core layer of a bimodal terpolymer and two outer layers comprising HDPE.

SONIC LABEL WELDING UNIT AND METHOD OF MANUFACTURING A MULTI-LAYERED CARE LABEL
20170305068 · 2017-10-26 ·

A sonic label welding device for welding multiple labels together using ultrasonic welding is disclosed. The sonic label welding device comprises a digital controls main menu screen which includes touch screen buttons that are utilized to go to specific screens to program the device to perform in a certain manner. For example, a user can press the cut to length button if wanting to cut a label to a specific length, or the label weld count button to specify the number of labels being sonically welded. Further, the sonic label welding device comprises a head for allowing multiple labels to be assembled under pressure and an anvil for directing the high frequency vibrations. A method of manufacturing a multi-layer care label is also disclosed.

IRIDESCENT BADGES FOR VEHICLES AND METHODS OF MAKING THE SAME

An iridescent vehicle badge (and methods for making it) that includes a translucent, polymeric badge having a non-planar shape and comprising an interior and an exterior surface. Further, at least one of the surfaces of the badge comprises a plurality of diffraction gratings that are integral with the badge, each having a thickness from 250 nm to 1000 nm and a varying period from 50 nm to 5 microns. In some cases, the thickness can range from 500 nm to 750 nm. The period, in some cases, can vary within a set of discrete values in one or more portions of the at least one of the surfaces of the badge, e.g., from 150 nm to 400 nm.

IRIDESCENT BADGES WITH EMBOSSED DIFFRACTION FILMS FOR VEHICLES AND METHODS OF MAKING THE SAME

A method of making an iridescent badge that includes: embossing a diffraction grating into a polymeric film to form a diffraction film; positioning the diffraction film in a mold; and injecting a translucent polymeric material into the mold over the diffraction film to form a vehicular badge. Further, the diffraction grating has a thickness from 250 nm to 1000 nm and a period from 50 nm to 5 microns. Another method of making an iridescent badge includes: heating a diffraction film positioned in a mold; applying a vacuum to form the film against a mold surface; and injecting a translucent polymeric material over the mold surface to form a vehicular badge. Further, the diffraction film comprises a polymeric material and a diffraction grating having a thickness from 250 nm to 1000 nm and a period from 50 nm to 5 microns.

Embossing or debossing of a label substrate

A label as shown and described herein. The label may include a label substrate, an adhesive adjacent the substrate, and a liner adjacent the adhesive, such that the adhesive is disposed between the label substrate and the liner, and wherein the label substrate is embossed or debossed, and the liner is not embossed or debossed.

SHRINK LABELS
20170283116 · 2017-10-05 ·

The invention relates to a shrink label. According to an embodiment the shrink label comprises an uniaxially oriented multilayer face film comprising skin layers including polyethylene polymer(s) and at least two cyclic polymers comprising different glass transition temperatures between 30 and 100° C. and the difference between the glass transition temperatures being between 5 and 60° C., and wherein the multilayer face film is seamed by a solvent. The invention further relates to a method for providing a shrink label, use of the shrink label, method for providing a shrink label and method for labelling.

POLYESTER RESIN FOR HEAT-SHRINKABLE FILM, HEAT-SHRINKABLE FILM, HEAT-SHRINKABLE LABEL, AND PACKAGED PRODUCT

The invention provides a polyester resin for heat-shrinkable film which contains terephthalic acid as a main component of a dicarboxylic acid component, contains ethylene glycol as a main component of a diol component, and contains from 18 to 32% by mole of neopentyl glycol and from 7 to 15% by mole of diethylene glycol when a total amount of the whole diol component in total polyester resin components is taken as 100% by mole. The polyester resin has (i) an intrinsic viscosity (IV) of not less than 0.65 and less than 0.70 dl/g, (ii) a carboxyl end group concentration (AV) of 8-25 eq/t, (iii) a color b value of 1.0-8.0 in an L*a*b* color system, and (iv) aluminum and phosphorus atoms, wherein the aluminum atoms are present in an amount of 15-40 ppm, and wherein the molar ratio of the phosphorus atoms to the aluminum atoms is 1.8-2.6.

METHOD AND DEVICE FOR THE APPLICATION OF SHRINK FILM SLEEVE

A method and a device for applying a shrink film sleeve to a container is provided. The method includes perforating the shrink film sleeve at predefined intervals, expanding the perforated shrink film sleeve by means of an expansion device, such as an expansion mandrel, conveying the expanded shrink film sleeve along the expansion device by a conveyor roller pair, tearing off the shrink film sleeve at the perforation by means of a downstream dispensing roller pair whose conveying speed is at least temporarily higher than the conveying speed of the conveyor roller pair, and shooting the torn-off shrink film sleeve onto the container.

DEVICE AND METHOD FOR MANUFACTURING EMBLEM WITH INCORPORATED IC CHIP
20170217084 · 2017-08-03 · ·

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

Multilayer blown films for shrink applications

The present invention discloses multilayer blown films for shrink label and related applications. These multilayer blown films can comprise a core layer containing an ethylene polymer, and inner and outer layers containing conjugated diene monovinylarene block copolymers.