The present invention provides a void-containing heat-shrinkable polyester film which has satisfactory shrinkage finishing properties and printability even if productivity is improved.

The void-containing heat-shrinkable polyester film is a multilayer structure having a non-foamed layer on both outer sides of the foamed layer, and by controlling the film thickness, density, and number of moles of the amorphous component on both outer sides, specific heat shrinkage characteristics and gloss can be improved.

The present invention relates to an MDO thermoresistant heat-shrinkable multilayer film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides an MDO thermoresistant heat-shrinkable multilayer film that includes multiple skin layers capable of improving thermal resistance formed on a substrate layer capable of providing high shrinkage, and simultaneously has excellent thermal resistance and high shrinkage properties through MD orientation instead of the conventional TD orientation method.

A method is proposed for transferring a bottom label and a wraparound label into an injection mould for producing an injection-moulded part provided with the labels, in that the bottom label is arranged on the end side and the wraparound label on the lateral side of an insert die and the insert die equipped with the two labels is introduced into the mould cavity of the moulding tool, after which the bottom label is deposited on the bottom and the wraparound label on the lateral surface of the mould cavity of the moulding tool, in order to back-mould them with a plastics material injected into the mould cavity. According to the invention, the method comprises the following steps of:providing an insert die, the end side of which has a central portion and a circumferential portion adjoining the central portion radially on the outside, wherein the central portion protrudes further in the direction of the free end of the insert die in the axial direction of the latter than the circumferential portion, such that the cross section of the insert die narrows in the direction of its free end, at least in the circumferential portion of its end side;applying the bottom label both to the central portion and to the circumferential portion of the end side of the insert die and applying the wraparound label to the lateral side thereof such that the wraparound label projects beyond the end, fining the end side, of the lateral side of the insert die in the direction of the free end thereof;introducing the insert die equipped with the two labels into the mould cavity of the moulding tool;detaching the wraparound label from the lateral side of the insert die and applying same at least to the lateral surface of the mould cavity of the moulding tool;detaching the bottom label from the end side of the insert die and applying same to the bottom of the mould cavity of the moulding tool, wherein the peripheral region of the bottom label is turned down from the circumferential portion of the end side of the insert die onto the bottom of the mould cavity of the moulding tool, such that it internally overlaps the edge, facing it, of the wraparound label; andextracting the insert die from the mould cavity of the moulding tool. The invention also relates to an injection-moulding device, suitable for carrying out such a method, having an insert die of the abovementioned type.

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

The present invention relates to a method for producing a squeeze tube with maximal surface area labeling and a tube produced thereby.

The invention relates to a method for the extrusion and labelling of a packaging tube (14), comprising the following successive steps performed on an extrusion-labelling line, namely: a) forming a partially or fully tubular label (17) from a film (12); b) introducing the label (17) into a calibration element (22); c) extruding a tubular body (13) on the side of the concave surface of the label (17); d) bringing the external surface of the tubular body (13) into contact with the concave surface of the label (17), step (c) being performed in the calibration element (22). The invention also relates to an extrusion-labelling device and a packaging tube.

A method for making labels comprising providing a plastic substrate layer and a paper substrate layer. The paper substrate layer comprises a printed display information sheet, wherein the printed display information sheet comprises a plurality of display information tags arranged in an array. The plastic substrate layer is coupled to each of the rows of display information tags within a first portion of the display information tags to form a composite substrate row. A first line of perforations is cut into a width of the composite substrate at one or more first spaced intervals, a length of the first spaced intervals being defined by a length of the display information tags. A a second line of perforations is cut into a width of the composite substrate at one or more second spaced intervals, a length of the second spaced intervals being defined by a height of the display information tags.

A multilayer, metallized, laminate film employed to form in-mold labels, includes first and second multilayer structures adhesively bonded together. The first multilayer structure includes a polymer core layer and first and second outer polymer layers on opposed sides of the core layer. The first outer polymer layer includes a metal layer thereon, and the second polymer layer having an outer matte surface that is adapted, in the in-mold label formed from laminate film, to engage and bond to a molded article. The second multilayer structure is a clear structure including a core layer and first and second outer polymer layers on opposed sides of the core layer. The bonded interface of the first and second multilayer structures is free of any printed indicia or other graphics. Preferably both outer surfaces of the film are bottom outer layers and include matte surfaces.

A label in accordance with this invention is formed from the above-described laminate film by printing an outer surface of the film either before or after the film/label is printed.

A method of applying a printed molded label formed from the laminate film of this invention to a molded article during the molding operation also forms a part of this invention.

A method for making labels comprising providing a plastic substrate layer and a paper substrate layer. The paper substrate layer comprises a printed display information sheet, wherein the printed display information sheet comprises a plurality of display information tags arranged in an array. The plastic substrate layer is coupled to each of the rows of display information tags within a first portion of the display information tags to form a composite substrate row. A first line of perforations is cut into a width of the composite substrate at one or more first spaced intervals, a length of the first spaced intervals being defined by a length of the display information tags. A second line of perforations is cut into a width of the composite substrate at one or more second spaced intervals, a length of the second spaced intervals being defined by a height of the display information tags.

The invention relates to providing a method for obtaining a multilayer film for thermally inducible shrink labels, products thereof and use of such products.