B32B9/002

PANEL
20230075615 · 2023-03-09 ·

A floor, wall or ceiling panel comprises a core and a decorative top layer provided on the core. The core comprises a magnesium oxide-based board material, and wherein the aforementioned panel, on at least two opposite edges, is provided with coupling means allowing that two of such panels can be interlocked at the respective edges.

DISPLAY SCREEN AND DISPLAY DEVICE

The present disclosure provides a display screen and a display device. The display screen includes a display panel, a cover plate, and a shielding layer disposed between the two. The display screen further includes a bonding layer disposed between the shielding layer and the display panel. The bonding layer includes a glue layer including a first side close to the display panel and a second side away from the display panel; and a light guiding portion including a light incident side configured to input ultraviolet light and a light-emitting side configured to output the ultraviolet light to the first side or the second side.

Sound Damping Wallboard and Method of Constructing a Sound Damping Wallboard

A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard includes a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a first sound damping layer disposed at the gypsum layer inner surface and having a first sound damping layer inner surface opposite the gypsum layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, a second encasing layer disposed at the first sound damping layer inner surface, and a second sound damping layer disposed at the second encasing layer opposite the first sound damping layer inner surface.

Composite tile, connection piece, system to be laid, and method for the production of a composite tile
09850668 · 2017-12-26 · ·

The invention relates to a composite tile for an installation system, more particularly for the production of a floor covering or wall covering, comprising a tile of a floor covering or wall covering and a backing disposed on the lay-on face of the tile. The invention also relates to a connecting element for the connection of two composite tiles and to an installation system composed of composite tiles and also to a method for the fabrication of a composite tile. The backing consists of a fiber composite material, more particularly fiber cement.

Sealing structure and organic electroluminescence device

A sealing structure with high air-tightness and an organic electroluminescence device with high air-tightness are provided regardless of a pattern of a first metal layer overlapping with glass frit. A second metal layer is provided in a region where a common power supply line overlaps with the glass frit. Since laser light is absorbed or reflected by the second metal layer, the glass frit can be uniformly heated. Therefore, an object to be sealed can be sealed with a low-melting-point glass in which a crack is not easily generated.

A FLOOR ELEMENT FOR FORMING A FLOOR COVERING AND A FLOOR COVERING
20220381043 · 2022-12-01 ·

Floor element for forming a floor covering, wherein the floor element comprises a decorative layer, a support layer, and an intermediate layer disposed between the decorative layer and the support layer, wherein the decorative layer is made of a brittle material, wherein the floor elements comprises edges provided with coupling elements adapted to cooperate with coupling elements of an adjacent similar floor element in said floor covering and wherein the intermediate layer comprises at least one edge that is offset relative to a respective edge of the decorative layer.

METHOD TO PRODUCE A PANEL AND SUCH A PANEL

A method to produce a panel. The method includes providing a core having a first surface, providing a surface layer including a substantially uncured amino resin, applying an hydrolysable adhesive on the first surface of the core and/or on a surface of the surface layer adapted to face the core, arranging the surface layer on the first surface of the core, pressing the surface layer to the core to form a panel by applying heat and pressure in a press, thereby adhering the surface layer to the core by the hydrolysable adhesive and curing the amino resin of the surface layer. Also such a panel.

ROOFING MEMBRANES WITH IMPROVED ADHESIVE BONDING STRENGTH
20220356707 · 2022-11-10 ·

Systems and methods are described herein for manufacturing and using roofing membranes that are faster and easier to install than conventional adhesive-only membrane materials. In some embodiments, membrane materials are surface treated using a plasma flow, e.g., a blown-arc plasma flow, atmospheric plasma, corona plasma, or from portable plasma units, generated by passing a compressed plasma-generating gas through an electrical current to form the plasma-treated roofing membrane. The plasma treatments described herein may be applied as part of the manufacturing process, or in-situ at the site of roof installation. In some embodiments, membrane materials have surface chemistries, roughnesses and other surface characteristics that yield desired adhesion properties.

Anti-ballistic materials and system

Anti-ballistic systems and methods for making same are described. The anti-ballistic systems may be formed from various materials arranged in a structure, such as a wall structure. For example, an anti-ballistic system may be formed from a metal material, a polymer material, and a stone material. In some embodiments, the metal material may include aluminum (for example, an aluminum composite panel), the polymer material may include ethylene vinyl acetate, and the stone material may include granite. The anti-ballistic wall systems may be configured to be resistant to ballistics, blasts, and/or forced entry.

Composite Epoxy Resin Board and Forming Method Thereof

A composite epoxy resin board, made from a raw material which includes the following weight percentage of components: waste prepreg powders of 5% to 100%, and waste printed circuit board (PCB) powders of 0% to 95%, is disclosed. The present invention adopts the waste prepregs as the main preparation raw material, which not only recycles and reuses prepreg scraps, but also reduces or even eliminates the use of adhesives due to the high epoxy resin content in the prepregs, while also reducing the glue-mixing time in the forming process, thereby simplifying the forming technology.