A plant structure includes a ceramic member including at least one of an oxide or an oxide hydroxide as a main component and substantially including no hydrate, and a plant-derived substance directly fixed to the ceramic member without interposing an adhesive substance different from a ceramic material making up the ceramic member. A building member and an interior member each include the plant structure.

A material can have a layered structure with at least a first layer, including a carbon-based material or a substrate of a material other than a carbon-based material, a second layer, including a carbon-based material, and a third, intermediate layer that separates and interconnects the first and second layers. The carbon-based material includes at least 50 at. % carbon, has a hexagonal lattice and the layer or layers including the carbon-based material has/have a thickness of 1-20 times the size of a carbon atom. The intermediate layer is a layer that includes a salt having ions that include at least two separate cyclic, planar groups that are capable of forming π-π-stacking with the material of the second layer and that the third, intermediate layer is connected to at least the second layer by π-π-stacking caused by said cyclic planar groups of the salt ions.

A structure capable of leaving a repetition of heating and cooling as a dynamic deformation amount. The structure retains joining performance of a laminated body made of two types of materials having different thermal properties.

The present disclosure generally relates to systems and methods for composites, including short-fiber films and other composites. In certain aspects, composites comprising a plurality of aligned fibers are provided. The fibers may be substantially aligned, and may be present at relatively high densities within the composite. For example, the composite may include substantially aligned carbon fibers embedded within a thermoplastic substrate. The composites may be prepared, in some aspects, by dispersing fibers by neutralizing the electrostatic interactions between the fibers, for example using aqueous liquids containing the fibers that are able to neutralize the electrostatic interactions that typically occur between the fibers. The liquids may be applied to a substrate, and the fibers may be aligned using techniques such as shear flow and/or magnetism. Other aspects are generally directed to methods of using such composites, kits including such composites, or the like.

In a first aspect, an article includes an inorganic substrate and a polymer film layer. The inorganic substrate includes a material including a ceramic, a glass, a glass-ceramic or a mixture thereof. The material includes a metal cation selected from the group consisting of silicon, aluminum, titanium, zirconium, tantalum, niobium and mixtures thereof and oxygen. The polymer film layer includes a polymer including an imide group. From an interface where the inorganic substrate contacts the polymer film layer, a line-profile of a CNO— signal from negative secondary ion mass spectroscopy decreases as it moves away from the interface and into the bulk of the polymer film layer.

An energy absorber for interposition between a cover and a covered object includes a generally planar matrix of cells. Each of the cells includes a plurality of generally elongate micro-elements interconnected to form a cell micro-structure, with each cell having a respective energy absorption capacity such that an energy absorption capacity of the energy absorber varies across at least one direction. The cells are configured such that impulse of an object with the cover with the energy absorber sandwiched between the cover and the covered object causes a deceleration vs. time response in the object, beginning with a generally linear rise in the deceleration to a peak deceleration within 5 ms after the beginning of the impulse event, followed by a generally nonlinear decrease in the deceleration over a period of not greater than 15 ms to a final target deceleration of not greater than 10% of the peak deceleration.

In a first aspect, an article includes a first polymer film layer and a second polymer film layer. The first polymer film layer includes a first polymer including a first imide group. The second polymer film layer includes a second polymer including a second imide group.

A polishing method using a polishing pad including a specific adsorption layer. The polishing pad has an adsorption layer including a silicone including linear polyorganosiloxane having vinyl groups only at both ends, and the like. The polishing pad is fixed to a surface plate, and a product to be polished is pressed against the polishing pad, and simultaneously slid to polish the product to be polished. In this case, the surface roughness (Ra) of the surface plate is set to 0.01 to 0.7 μm, and the adsorption layer of the polishing pad is then adsorbed and fixed to the surface plate to perform polishing work. By adjusting the surface roughness of the surface plate as described above, a surface of the product to be polished can be inhibited from being unpredictably scratched or roughened. The method for adjusting the surface roughness of the surface plate is preferably a method in which a film having a surface roughness as described above is bonded to a surface of the surface plate.

The invention relates to a multilayer wood composite block comprising a plurality of wood layers, wherein at least 5 wood layers of the plurality of wood layers have a layer thickness of 0.05 to 1 mm; a plurality of plastic layers, wherein at least 5 plastic layers of the plurality of plastic layers consist of translucent and/or transparent plastic and have a layer thickness of 0.05 to 1 mm; and a plurality of adhesive layers; wherein the wood and/or plastic layers are arranged in a superimposed manner; and wherein the adhesive layers are arranged between successive wood and/or plastic layers and bond them together; and a multilayer wood veneer.

A parallel optical interconnect having an optoelectronic substrate connected to a transceiver electronics substrate is disclosed. The optoelectronic substrate may hold optical transmitters and receivers and be electrically connected to the transceiver electronics substrate that may hold transmitter and receiver circuitries. The two substrates may be electrically connected with each other by inter-substrate interconnects, and the optoelectronic substrate may have through-substrate vias connecting the transmitters and receivers to the inter-substrate interconnects.