An Fe—Co—Al alloy magnetic thin film contains, in terms of atomic ratio, 20% to 30% Co and 1.5% to 2.5% Al. The Fe—Co—Al alloy magnetic thin film has a crystallographic orientation such that the (100) plane is parallel to a substrate surface and the <100> direction is perpendicular to the substrate surface. The Fe—Co—Al alloy magnetic thin film has good magnetic properties, that is, a magnetization of 1440 emu/cc or more, a coercive force of less than 100 Oe, a damping factor of less than 0.01, and an FMR linewidth ΔH at 30 GHz of less than 70 Oe.

An Fe—Co—Al alloy magnetic thin film contains, in terms of atomic ratio, 20% to 30% Co and 1.5% to 2.5% Al. The Fe—Co—Al alloy magnetic thin film has a crystallographic orientation such that the (100) plane is parallel to a substrate surface and the <100> direction is perpendicular to the substrate surface. The Fe—Co—Al alloy magnetic thin film has good magnetic properties, that is, a magnetization of 1440 emu/cc or more, a coercive force of less than 100 Oe, a damping factor of less than 0.01, and an FMR linewidth ΔH at 30 GHz of less than 70 Oe.

Disclosed is a method for forming a hollow pipe-sandwiching metal plate and applications thereof. The hollow pipe-sandwiching metal plate comprises a first panel, a second panel, and multiple hollow pipes between the first panel and the second panel; gaps are arranged among the hollow pipes, and the hollow pipes are connected to the first panel and the second panel by brazing. The present disclosure further includes the applications of the hollow pipe-sandwiching metal plate. The hollow pipe-sandwiching metal plate has advantages, such as light weight, high strength, low stress, high temperature resistance, pressure bearing, thermal insulation and vibration isolation. The metal plate will not deform due to thermal difference, thereby providing permanent service life of the metal plate.

A coating-substrate combination includes: a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; and a coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr; 3.0-13.5 Co; up to 6.0 Ta, if any; up to 6.2 W, if any; up to 2.4 Mo, if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y, if any; up to 0.4 Zr, if any; up to 1.0 Re, if any.

A coating-substrate combination includes: a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; and a coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr; 3.0-13.5 Co; up to 6.0 Ta, if any; up to 6.2 W, if any; up to 2.4 Mo, if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y, if any; up to 0.4 Zr, if any; up to 1.0 Re, if any.

A hot-dip coated steel product including: a steel product; and a coating layer including a Zn—Al—Mg alloy layer disposed on a surface of the steel product, in which the Zn—Al—Mg alloy layer includes a Zn phase, an Al phase, and a MgZn.sub.2 phase, and contains a Mg—Sn intermetallic compound phase in the Zn phase, and the coating layer has a chemical composition satisfying a predetermined average composition, a total area proportion of the Al phase and the MgZn.sub.2 phase is 70% or more, an area proportion of the Zn phase is 30% or less, an average value of cumulative circumferential lengths of the Al phase is less than 88 mm/mm.sup.2, and a total frequency in number of the Al phase having a circumferential length of 50 μm or more is less than 100.

A lead-free solder material is provided. In one example, the solder material may include solder particles including at least 30 wt % nickel, and an activator including or consisting of at least one of a group of activator materials, the group including an organic acid or salt thereof, and an amine or salt thereof.

A lead-free solder material is provided. In one example, the solder material may include solder particles including at least 30 wt % nickel, and an activator including or consisting of at least one of a group of activator materials, the group including an organic acid or salt thereof, and an amine or salt thereof.

A method is for producing a high strength coated steel sheet having a yield stress YS>800 MPa, a tensile strength TS>1180 MPa, and improved formability and ductility. The steel contains: 15%≤C≤0.25%, 1.2%≤Si≤1.8%, 2%≤Mn≤2.4%, 0.1%≤Cr≤0.25%, Al≤0.5%, the remainder being Fe and unavoidable impurities. The sheet is annealed at a temperature higher than Ac3 and lower than 1000° C. for a time of more than 30 s, then quenched by cooling it to a quenching temperature QT between 250° C. and 350° C., to obtain a structure consisting of at least 60% of martensite and a sufficient austenite content such that the final structure contains 3% to 15% of residual austenite and 85% to 97% of martensite and bainite without ferrite, then heated to a partitioning temperature PT between 430° C. and 480° C. and maintained at this temperature for a partitioning time Pt between 10 s and 90 s, then hot dip coated and cooled to the room temperature.

A method is for producing a high strength coated steel sheet having a yield stress YS>800 MPa, a tensile strength TS>1180 MPa, and improved formability and ductility. The steel contains: 15%≤C≤0.25%, 1.2%≤Si≤1.8%, 2%≤Mn≤2.4%, 0.1%≤Cr≤0.25%, Al≤0.5%, the remainder being Fe and unavoidable impurities. The sheet is annealed at a temperature higher than Ac3 and lower than 1000° C. for a time of more than 30 s, then quenched by cooling it to a quenching temperature QT between 250° C. and 350° C., to obtain a structure consisting of at least 60% of martensite and a sufficient austenite content such that the final structure contains 3% to 15% of residual austenite and 85% to 97% of martensite and bainite without ferrite, then heated to a partitioning temperature PT between 430° C. and 480° C. and maintained at this temperature for a partitioning time Pt between 10 s and 90 s, then hot dip coated and cooled to the room temperature.