A method and structure for processing a plurality of prepreg sheets includes a conveyor assembly having a first conveyor, a second conveyor, and a processing zone positioned between the first and second conveyors. In an implementation, a plurality of prepreg sheets are advanced from a plurality of material supply creels into the processing zone by a first conveyor and a second conveyor turning in opposite directions. Within the processing zone, a compressive pressure is applied to the prepreg sheets by first pressure plates attached to first conveyor and second pressure plates attached to the second conveyor. A thermoplastic within the prepreg sheets is melted within the processing zone by a heater to consolidate the prepreg sheets into a consolidated laminate.

A method and structure for processing a plurality of prepreg sheets includes a conveyor assembly having a first conveyor, a second conveyor, and a processing zone positioned between the first and second conveyors. In an implementation, a plurality of prepreg sheets are advanced from a plurality of material supply creels into the processing zone by a first conveyor and a second conveyor turning in opposite directions. Within the processing zone, a compressive pressure is applied to the prepreg sheets by first pressure plates attached to first conveyor and second pressure plates attached to the second conveyor. A thermoplastic within the prepreg sheets is melted within the processing zone by a heater to consolidate the prepreg sheets into a consolidated laminate.

Two-component solventless polyurethane adhesive compositions comprising an isocyanate component and an isocyanate-reactive are disclosed, the compositions comprising an isocyanate component comprising an isocyanate-terminated prepolymer and an isocyanate-reactive component comprising a hydroxy-terminated polyurethane resin, a polyether polyol, a phosphate ester adhesion promoter, and, optionally, a bio-based polyol. Methods for forming laminate structures are also disclosed, the methods comprising forming an adhesive composition by mixing an isocyanate adhesive component comprising an isocyanate-terminated prepolymer and an isocyanate-reactive adhesive component comprising a hydroxy-terminated polyurethane resin, a polyether polyol, a phosphate ester adhesion promoter, and optionally, a bio-based polyol, applying the adhesive composition to a surface of a first substrate, and bringing a surface of a second substrate into contact with the adhesive composition on the surface of the first substrate, thereby forming the laminate structure. Laminate structures are also disclosed.

A metal/resin composite structure includes: a metal member (M) having a fine uneven surface; and a polyamide-based resin member (A) bonded to the metal member (M), and the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]: [A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) is equal to or higher than 85° C. and equal to or lower than 140° C.; and [A2] a crystallization temperature (Tc) observed by a differential scanning calorimeter (DSC) is equal to or higher than 250° C. and equal to or lower than 292° C.

Provided herein are multilayer damping laminates comprising at least one constraining layer and at least one discontinuous damping layer. At least one discontinuous damping layer comprises one or more damping material regions and one or more gap regions, wherein the percent coverage of at least one discontinuous damping layer by one or more damping material regions is less than 99%. Also provided are systems and methods using the multilayer damping laminates.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

The present disclosure is directed to an exterior surface protective layer for protecting a composite structure from environmental conditions including: at least one curable film; such as at least two curable films, and an electrically conductive material, wherein the electrically conductive material comprises a wire-free electrically conductive material, and/or an electrically conductive polymer weave, wherein the at least one curable film includes at least one of polyurethane, polyimide, polyester or epoxy upon curing, and wherein a weight of the exterior surface protective layer ranges from about 0.02 pounds per square foot to about 0.1 pounds per square foot. An exterior surface protected composite structure and methods of forming an exterior surface protected composite structure are also provided.

In an example, a method for accelerated conditioning of a composite core sandwich coupon is described. The method includes setting a first temperature and a first relative humidity level of the conditioning apparatus, wherein a combination of the first temperature and the first relative humidity level correspond to a desired relative humidity level of the plurality of cells of the core layer at room temperature. The method includes maintaining the first temperature and the first relative humidity for a first period, wherein during the first period a core humidity of the plurality of cells in the core layer approaches the first relative humidity level. The method includes determining that the core humidity has reached the first relative humidity level. The method includes, based on determining that the core humidity has reached the first relative humidity level, adjusting the first temperature to a second temperature.

This invention relates to devices integrally comprising fibres that have emissivities, particularly of infrared radiation, that can be controllably varied. The active emissive surface comprises graphene layers with intercalated ions.