Fiber-reinforced composites is provided. The composites include a plurality of prepreg layers, each comprising a polymeric resin and a plurality of fibers disposed therein; and at least one electrically-conductive layer at least partially embedded in the plurality of prepreg layers. These fiber-reinforced composites can save weight relative to externally provided wires and can be provided in forms suitable for use in automated fiber placement and automated tape layup machines. Advantageous applications include uses in lightning strike protection, energy storage, signal transmission, and power distribution.

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.

Described in this disclosure is a surface configured to break down deposits thereon. The surface may include breakdown structures, oleophilic structures, and hydrophilic structures. The oleophilic structures and hydrophilic structures are configured to disperse a deposit, such as fingerprint residue, to the breakdown structures. This dispersion increases the surface area of the deposit with respect to the breakdown structures, increasing the contact area between the two. The breakdown structures modify the deposit physically, chemically, or both, such that fragments are distributed into the ambient environment. The surface may be applied to portable electronic devices.

The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (T.sub.g), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.

The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (T.sub.g), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.

A sheet-type aerosol generating article includes at least two aerosol generating sheets each having aerosol generating material and an inductively heatable susceptor The inductively heatable susceptor is positioned between the aerosol generating sheets and each of the aerosol generating sheets has an exposed surface. Methods for manufacturing sheet-type aerosol generating articles are also disclosed.

A sheet-type aerosol generating article includes at least two aerosol generating sheets each having aerosol generating material and an inductively heatable susceptor The inductively heatable susceptor is positioned between the aerosol generating sheets and each of the aerosol generating sheets has an exposed surface. Methods for manufacturing sheet-type aerosol generating articles are also disclosed.

A sound-attenuating composite structure may comprise a honeycomb core assembly having a plurality of honeycomb cells defined by sidewalls, wherein the honeycomb core assembly is sandwiched between an inner impervious skin and a perforated outer skin. The sound-attenuating composite structure may further comprise a ceramic foam insert received in each of the honeycomb cells at a predetermined insertion depth to form an obstruction therein. Each of the ceramic foam inserts may have a predetermined thickness defined between substantially flat top and bottom surfaces. The sound-attenuating composite structure may have predetermined acoustic performance characteristic that are controlled, at least in part, by the predetermined thickness and the predetermined insertion depth.

The disclosure provides an adjusting device having an active region and a peripheral region adjacent to the active region. The adjusting device includes a first substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer, and a sealant layer. The first insulating layer is disposed on the first conducting layer and includes a first opening disposed in the peripheral region. The second conducting layer is disposed on the first conducting layer and electrically connected to the first conducting layer through the first opening. The second insulating layer includes multiple first protruding structures disposed in the peripheral region and on the first insulating layer. The sealant layer is disposed in the peripheral region and on the second insulating layer. The first opening is disposed between two of the first protruding structures.