A moisture-curable polyurethane hot melt adhesive composition having good oleic acid resistance, especially when exposed to 100% pure oleic acid under aging condition of 65° C. and 90% relative humidity, wherein the adhesive composition comprises, consists essentially of or consists of a moisture-curable polyurethane prepolymer, the prepolymer being a reaction product of at least one amorphous polyester polyol containing an aromatic group and at least one polyisocyanate, preferably at least one polyisocyanate containing an aromatic group, wherein the aromatic group is comprised in the polyurethane prepolymer in a content of no less than 23 wt. %, preferably no less than 25 wt. %, more preferably no less than 30 wt. %.

A hose is provided capable of meeting fireproof requirements per AS1055 under no flow condition. The hose has multiple layers including a yttria-stabilized zirconia (YSZ) flexible ceramic substrate layer disposed between first and second silicone rubber layers.

This disclosure includes high-temperature, thermally-insulative laminates, Some laminates have a front surface, a back surface, one or more heat-dispersing layers, each comprising at least 90% by weight of: a metal having a melting point of at least 1,300° C. and a thermal conductivity of at least 15 W/Km; or graphite, and one or more heat-insulating layers coupled to the heat-dispersing layer(s), the heat-insulating layer(s) each including a layer of polymeric aerogel, wherein at least a majority of the front surface is defined by one of the heat-dispersing layer(s).

A substrate for a printed wiring board includes a base layer, and a copper foil directly or indirectly stacked on at least a part of one or both surfaces of the base layer. The base layer includes a matrix containing a fluororesin as a main component and one or more reinforcing material layers included in the matrix, and a ratio B/A is 0.003 to 0.37, where A is an average thickness of the base layer, and B is an average distance between a surface of the copper foil facing the matrix and a surface of a reinforcing material layer closest to the surface of the copper foil facing the copper foil.

A method of manufacturing a microfluidic system or microfluidic device having at least one channel includes providing a base sheet, providing a deformable intermediate layer, providing a cover film, and laminating the base sheet, the intermediate layer and the cover film so that a back surface of the intermediate layer is attached to a front surface of the base sheet and a back surface of the cover film is attached to a front surface of the intermediate layer opposite to the back surface thereof, thereby forming a laminate comprising the base sheet, the intermediate layer and the cover film. Further, the method includes applying pressure to the front surface of the intermediate layer through the cover film so as to deform the intermediate layer, thereby forming the at least one channel. The invention also relates to a microfluidic system or microfluidic device) manufactured by this method.

A method of manufacturing a microfluidic system or microfluidic device having at least one channel includes providing a base sheet, providing a deformable intermediate layer, providing a cover film, and laminating the base sheet, the intermediate layer and the cover film so that a back surface of the intermediate layer is attached to a front surface of the base sheet and a back surface of the cover film is attached to a front surface of the intermediate layer opposite to the back surface thereof, thereby forming a laminate comprising the base sheet, the intermediate layer and the cover film. Further, the method includes applying pressure to the front surface of the intermediate layer through the cover film so as to deform the intermediate layer, thereby forming the at least one channel. The invention also relates to a microfluidic system or microfluidic device) manufactured by this method.

A composite cover includes a generally rectangular main portion having four main portion edges about a perimeter of the main portion and having opposing top and bottom surfaces defining respective upward and downward directions, and four generally rectangular side portions each contiguous with and extending downward from a respective one of the main portion edges. The main portion and the four side portions generally enclose an interior space and are made of a sandwich structure comprising an interior layer of continuous fiber reinforcements and resin and an exterior layer of metallic foil bonded to the interior layer. A method of manufacturing the cover, having a desired shape generally of a five-walled open box, includes attaching a formed sheet made of metallic foil and having the desired shape onto a shaped composite preform disposed in the desired shape, wherein the shaped composite preform is made of continuous fiber reinforcements and resin.

A composite cover includes a generally rectangular main portion having four main portion edges about a perimeter of the main portion and having opposing top and bottom surfaces defining respective upward and downward directions, and four generally rectangular side portions each contiguous with and extending downward from a respective one of the main portion edges. The main portion and the four side portions generally enclose an interior space and are made of a sandwich structure comprising an interior layer of continuous fiber reinforcements and resin and an exterior layer of metallic foil bonded to the interior layer. A method of manufacturing the cover, having a desired shape generally of a five-walled open box, includes attaching a formed sheet made of metallic foil and having the desired shape onto a shaped composite preform disposed in the desired shape, wherein the shaped composite preform is made of continuous fiber reinforcements and resin.

A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.

A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.