The invention relates to a packaging container (1, 2) for loose or free-flowing filling material, said packaging container consisting of plastic monofilm or composite film with at least one layer of plastic and forming, in a filled and closed form, a wrapping of the filling material with two mutually opposing main walls (3, 4) which act as bearing faces in a stack with other filled packaging containers and consist of thermoplastic, at least on the outer surfaces (15) thereof. The packaging container according to the invention is designed to be stackable in a non-slip manner but also easily removable from the stack and to this end, for practical production and processing, is designed such that the two surfaces (15) are embossed for a surface roughness having a roughness depth of 20-40 μm.

The invention relates to a packaging container (1, 2) for loose or free-flowing filling material, said packaging container consisting of plastic monofilm or composite film with at least one layer of plastic and forming, in a filled and closed form, a wrapping of the filling material with two mutually opposing main walls (3, 4) which act as bearing faces in a stack with other filled packaging containers and consist of thermoplastic, at least on the outer surfaces (15) thereof. The packaging container according to the invention is designed to be stackable in a non-slip manner but also easily removable from the stack and to this end, for practical production and processing, is designed such that the two surfaces (15) are embossed for a surface roughness having a roughness depth of 20-40 μm.

A metal/resin composite structure includes: a metal member (M) having a fine uneven surface; and a polyamide-based resin member (A) bonded to the metal member (M), and the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]: [A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) is equal to or higher than 85° C. and equal to or lower than 140° C.; and [A2] a crystallization temperature (Tc) observed by a differential scanning calorimeter (DSC) is equal to or higher than 250° C. and equal to or lower than 292° C.

A metal/resin composite structure includes: a metal member (M) having a fine uneven surface; and a polyamide-based resin member (A) bonded to the metal member (M), and the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]: [A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) is equal to or higher than 85° C. and equal to or lower than 140° C.; and [A2] a crystallization temperature (Tc) observed by a differential scanning calorimeter (DSC) is equal to or higher than 250° C. and equal to or lower than 292° C.

Provided herein are multilayer damping laminates comprising at least one constraining layer and at least one discontinuous damping layer. At least one discontinuous damping layer comprises one or more damping material regions and one or more gap regions, wherein the percent coverage of at least one discontinuous damping layer by one or more damping material regions is less than 99%. Also provided are systems and methods using the multilayer damping laminates.

Provided herein are multilayer damping laminates comprising at least one constraining layer and at least one discontinuous damping layer. At least one discontinuous damping layer comprises one or more damping material regions and one or more gap regions, wherein the percent coverage of at least one discontinuous damping layer by one or more damping material regions is less than 99%. Also provided are systems and methods using the multilayer damping laminates.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

Systems and methods are provided for simulating traction power and control in transportation systems under design conditions and/or utilizing real-time data.

Systems and methods are provided for simulating traction power and control in transportation systems under design conditions and/or utilizing real-time data.