The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the metal sheet, and a second resin film formed on the other surface of the metal sheet and containing a thermoplastic polyester resin, the laminate film includes an adhesion layer containing a polypropylene-based resin and a polyethylene-based resin and a base layer containing a modified polypropylene-based resin, an amount of the polyethylene-based resin in the adhesion layer is 1.0 mass % or more and 45.0 mass % or less of the resins of the adhesion layer, the melting point of the second resin film is higher than the melting point of the adhesion layer by 40° C. or more and is higher than the heating temperature of a heat sealing tool, the thickness of the adhesion layer is 1.0 μm or more and 15.0 μm or less, and the thickness of the base layer is 1.0 μm or more and 18.0 μm or less.

A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the metal sheet, and a second resin film formed on the other surface of the metal sheet and containing a thermoplastic polyester resin, the laminate film includes an adhesion layer containing a polypropylene-based resin and a polyethylene-based resin and a base layer containing a modified polypropylene-based resin, an amount of the polyethylene-based resin in the adhesion layer is 1.0 mass % or more and 45.0 mass % or less of the resins of the adhesion layer, the melting point of the second resin film is higher than the melting point of the adhesion layer by 40° C. or more and is higher than the heating temperature of a heat sealing tool, the thickness of the adhesion layer is 1.0 μm or more and 15.0 μm or less, and the thickness of the base layer is 1.0 μm or more and 18.0 μm or less.

The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.

A method includes identifying a location of a locating feature disposed on an exterior profile of a lower substrate, the locating feature configured to identify a specified location of the exterior profile, positioning a self-piercing rivet along an upper substrate according to the identified location of the locating feature, and installing the self-piercing rivet through the upper substrate and into the lower substrate.

A method includes identifying a location of a locating feature disposed on an exterior profile of a lower substrate, the locating feature configured to identify a specified location of the exterior profile, positioning a self-piercing rivet along an upper substrate according to the identified location of the locating feature, and installing the self-piercing rivet through the upper substrate and into the lower substrate.

An aluminum alloy brazing sheet may include a sacrificial material having a function of a brazing material on at least one surface of a core material, wherein the sacrificial material has a composition containing: in a mass %, 2% to 5% of Si; 3% to 5% of Zn; and an Al balance with inevitable impurities the core material is made of an Al—Mn-based alloy, an in the core material before brazing, Al—Mn based secondary particles having an equivalent circle diameter of 100 to 400 nm are distributed with a number density of 0.3 to 5 particles/μm.sup.2.

Method for packaging electrical insulators (4) for high voltage or very high voltage, such as electrical line insulators made with a dielectric material chosen from glass or porcelain, and more specifically, electrical insulators with a protective hydrophobic silicone elastomer coating covering the surface of the electrical insulators, under vacuum or under inert gas.

In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a D.sub.f of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.