Patent classifications
B32B15/20
COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF
The invention is directed to a composite structure in which a metal member having a roughened surface and a resin member are joined in a state in which at least a portion of the roughened surface is included. The resin member is made of a molded article obtained by melt-molding a polyarylene sulfide resin composition containing a polyarylene sulfide resin. In the roughened surface, a cumulative pore volume of a pore diameter in a range of 0.1 μm to 20 μm is in a range of 0.5 nL/mm.sup.2 or more and 5 nL/mm.sup.2 or less measured by mercury porosimetry. According to the invention, it is possible to provide a composite structure that is obtained by joining a metal member and a molded article made of polyarylene sulfide resin composition and is more excellent in joining strength, heat cycle resistance, and sealing properties, and a method for producing the composite structure.
COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF
The invention is directed to a composite structure in which a metal member having a roughened surface and a resin member are joined in a state in which at least a portion of the roughened surface is included. The resin member is made of a molded article obtained by melt-molding a polyarylene sulfide resin composition containing a polyarylene sulfide resin. In the roughened surface, a cumulative pore volume of a pore diameter in a range of 0.1 μm to 20 μm is in a range of 0.5 nL/mm.sup.2 or more and 5 nL/mm.sup.2 or less measured by mercury porosimetry. According to the invention, it is possible to provide a composite structure that is obtained by joining a metal member and a molded article made of polyarylene sulfide resin composition and is more excellent in joining strength, heat cycle resistance, and sealing properties, and a method for producing the composite structure.
MULTILAYER BODY AND ELECTRONIC COMPONENT FORMED OF SAME
A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.
RESIN COMPOSITION, AND FILM AND MULTILAYER STRUCTURE USING THE SAME
The present disclosure provides a resin composition containing a bio-polyethylene resin (A), an ethylene-vinyl alcohol copolymer (B), and an alkali metal salt (C), wherein the content of the alkali metal salt (C) is 10 ppm to 1500 ppm, in terms of metal, with respect to the weight of the ethylene-vinyl alcohol copolymer (B). With this resin composition, gel formation and a reduction in transparency during molding are suppressed, and a molded product having an excellent appearance can thus be obtained.
LAMINATE
An object of the present invention is to provide a laminate having a smaller transmission loss in a high frequency band.
A laminate having a metal layer and a resin layer in contact with at least one surface of the metal layer, in which a dielectric loss tangent of the resin layer at a temperature of 23° C. and a frequency of 28 GHz is less than 0.002, and an average length RSm at an interface between the metal layer and the resin layer in a cross-section along a thickness direction of the laminate is 1.2 μm or less.
LAMINATE
An object of the present invention is to provide a laminate having a smaller transmission loss in a high frequency band.
A laminate having a metal layer and a resin layer in contact with at least one surface of the metal layer, in which a dielectric loss tangent of the resin layer at a temperature of 23° C. and a frequency of 28 GHz is less than 0.002, and an average length RSm at an interface between the metal layer and the resin layer in a cross-section along a thickness direction of the laminate is 1.2 μm or less.
Wrapper for foodstuffs
Apparatuses, systems, and methods are presented for a wrapper for foodstuffs. An elastomeric layer is flexible and substantially planar. A metallic layer is malleable and substantially planar. An adhesive couples the metallic layer to at least a perimeter of the elastomeric layer so that the elastomeric layer, the metallic layer, and the adhesive comprise a food covering for a container and the metallic layer is configured to conform around an edge of the container.
Wrapper for foodstuffs
Apparatuses, systems, and methods are presented for a wrapper for foodstuffs. An elastomeric layer is flexible and substantially planar. A metallic layer is malleable and substantially planar. An adhesive couples the metallic layer to at least a perimeter of the elastomeric layer so that the elastomeric layer, the metallic layer, and the adhesive comprise a food covering for a container and the metallic layer is configured to conform around an edge of the container.
SUPPORT SHEET, FLEXIBLE DISPLAY SCREEN AND ELECTRONIC DEVICE
Provided in the embodiments of the present disclosure are a support sheet for supporting a flexible display screen, a flexible display screen and an electronic device. The flexible display screen support sheet includes a carbon fiber substrate and an epoxy resin adhesive. The carbon fiber substrate includes first carbon fibers in a first direction and a second carbon fibers in a second direction, and the first direction being different from and angled with the second direction.
Flexible packaging material
Described herein is a process for preparing a flexible packaging material. The process may comprise: providing a printed first flexible substrate comprising an ink composition on a surface of a first flexible substrate, the ink composition comprising a first thermoplastic resin; depositing a further composition comprising a cross-linker, a white pigment and a second thermoplastic resin onto the printed ink composition such that the thermoplastic resin of the ink composition is cross-linked; and laminating the first flexible substrate with a second flexible substrate such that the ink composition, the further composition and the cross-linker are disposed between the first and second flexible substrates.