B32B15/20

THERMOPLASTIC ELASTOMER COMPOSITION, LAMINATE STRUCTURE AND METHOD FOR PRODUCING SAID LAMINATE STRUCTURE

A thermoplastic elastomer composition including an acrylic block copolymer (I) and a hydrogenated block copolymer (II). The content of the acrylic block copolymer (I) is 70 to 300 parts by mass with respect to 100 parts by mass of the hydrogenated block copolymer (II); the hydrogenated block copolymer (II) is a hydrogenated product of a block copolymer (P) including a polymer block (A1) containing structural units derived from an aromatic vinyl compound, and a polymer block (B1) containing 1 to 100 mass % of structural units (b1) derived from farnesene and 99 to 0 mass % of structural units (b2) derived from a conjugated diene other than farnesene, the mass ratio [(A1)/(B1)] of the polymer block (A1) to the polymer block (B1) being 1/99 to 70/30; and the hydrogenation ratio of carbon-carbon double bonds in the polymer block (B1) is 50 to 100 mol %.

VACUUM ADIABATIC BODY AND REFRIGERATOR
20230003438 · 2023-01-05 ·

An vacuum adiabatic body includes a first plate, a second plate, and a support configured to maintain a vacuum space between the first and second plates. The support includes a support plate supported on an inner surface of one of the first plate and the second plate and a bar extending from the support plate. The bar contacts an inner surface of the other of the first plate and the second plate. The one end of the bar has a cross-section less than that of the other end of the bar.

DOUBLE-SIDED COPPER-CLAD LAMINATE

A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

DOUBLE-SIDED COPPER-CLAD LAMINATE

A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

RESIN COATED COPPER AND CIRCUIT BOARD INCLUDING THE SAME
20230240008 · 2023-07-27 ·

A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.

RESIN COATED COPPER AND CIRCUIT BOARD INCLUDING THE SAME
20230240008 · 2023-07-27 ·

A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.

METHOD FOR MANUFACTURING A STRUCTURE WITH CELLULAR CORES FOR A TURBOJET NACELLE

A method for manufacturing an alveolar core structure includes at least one cell including a secondary duct having a first end defining a sound wave inlet, and an opposite second end, the secondary duct comprising a sound wave outlet. The method also includes a fastening step in which adhesive tapes transverse to the longitudinal direction of said first plate are applied on a first longitudinal plate. The secondary duct in the form of a flattened element is fastened, on the first plate, by gluing at its sound wave inlet. A second plate is applied. A step of deploying the first and second plates so as to form the peripheral wall of the cells and so that the flattened element is deployed.

MAGNETIC DISK SUBSTRATE AND MAGNETIC DISK USING MAGNETIC DISK SUBSTRATE

A magnetic disk substrate includes an aluminum alloy including one type or two or more types of Fe: 8.5 mass % or less, Mn: 2.5 mass % or less, Ni: 6.5 mass % or less, and Mg: 4.5 mass % or less, a balance being Al and unavoidable impurities, wherein, when f (Hz) is a resonance frequency, ρ (g/cm.sup.3) is a density, and t (mm) is a plate thickness, (f×ρ/t) is 3800 or greater; and a magnetic disk using the magnetic disk substrate.

MAGNETIC DISK SUBSTRATE AND MAGNETIC DISK USING MAGNETIC DISK SUBSTRATE

A magnetic disk substrate includes an aluminum alloy including one type or two or more types of Fe: 8.5 mass % or less, Mn: 2.5 mass % or less, Ni: 6.5 mass % or less, and Mg: 4.5 mass % or less, a balance being Al and unavoidable impurities, wherein, when f (Hz) is a resonance frequency, ρ (g/cm.sup.3) is a density, and t (mm) is a plate thickness, (f×ρ/t) is 3800 or greater; and a magnetic disk using the magnetic disk substrate.

POLYAMIDE-METAL LAMINATES
20230001669 · 2023-01-05 ·

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.