An electro-optic window includes a first substrate; an electro-optic element generally parallel to the first substrate, the electro-optic element including: a second substrate; a third substrate generally parallel to the second substrate; a sealing member disposed along at least a portion of a perimeter of one of the second and third substrates and extending therebetween; and a cavity defined between the second and third substrates. The sealing member defines the sidewalls of the cavity. A first layer of film having a perimeter portion and a central portion is disposed between at least a portion of the first and second substrates, and may be coextensive with the sealing member.

The invention relates to an insulated panel, in particular a wall panel or roof panel, including a foamed core layer and a cover layer affixed to the foamed core layer. The invention also relates to an insulating covering, in particular a wall covering or floor covering, including a plurality said insulated panels.

An example electronic device includes a transparent cover; and a flexible display coupled to the cover. The cover may include a first layer including glass; a second layer positioned between the first layer and the flexible display; and a third layer positioned between the first layer and the second layer. The third layer includes a pattern overlapping a folding part of the flexible display and including a plurality of grooves formed in a bonding surface with the second layer, and has a hardness greater than that of the second layer.

An example electronic device includes a transparent cover; and a flexible display coupled to the cover. The cover may include a first layer including glass; a second layer positioned between the first layer and the flexible display; and a third layer positioned between the first layer and the second layer. The third layer includes a pattern overlapping a folding part of the flexible display and including a plurality of grooves formed in a bonding surface with the second layer, and has a hardness greater than that of the second layer.

A structure that forms a visual representation may include a first outer layer, a second outer layer, and an interlayer being disposed between the first outer layer and the second outer layer. The interlayer may have a first side adjacent to the first outer layer and a second side adjacent to the second outer layer. The interlayer includes a plurality of cuts extending from the first side of the interlayer towards the second side of the interlayer. Each of the plurality of cuts may have an angle with respect to a plane formed by a surface of the first side of the interlayer. Each angle for at least a portion of the plurality of cuts is based on one or more pixel values of at least one image that forms the basis of the visual representation.

A structure that forms a visual representation may include a first outer layer, a second outer layer, and an interlayer being disposed between the first outer layer and the second outer layer. The interlayer may have a first side adjacent to the first outer layer and a second side adjacent to the second outer layer. The interlayer includes a plurality of cuts extending from the first side of the interlayer towards the second side of the interlayer. Each of the plurality of cuts may have an angle with respect to a plane formed by a surface of the first side of the interlayer. Each angle for at least a portion of the plurality of cuts is based on one or more pixel values of at least one image that forms the basis of the visual representation.

The present disclosure relates to a vacuum insulated glazing (VIG) unit and tempered glass pane therefore. Furthermore, the present disclosure relates to a window comprising a VIG unit enclosed in a frame. Also, the present invention relates to a method of producing a tempered glass pane for a VIG unit, a method for producing a VIG unit and the use of a tempered glass pane as described herein in a VIG unit and the production thereof.

A seamless three-dimensional cover (1) for an electronic device (2), the seamless three-dimensional cover (1) comprising of at least one glass base layer (3) and at least one glass rim layer (4). At least one layer of color inducing film (5) is arranged between at least one of the base layer (3) and the rim layer (4), or between two adjacent rim layers (4). The base layer (3), the rim layer(s) (4), and the layer of color inducing film (5) are fused together to form the seamless three-dimensional cover (1). This facilitates a strong and durable three-dimensional cover, which cover is translucent as well as at least partially colored. Furthermore, the cover does not affect the function of components such as millimeter-wave antennas.

A seamless three-dimensional cover (1) for an electronic device (2), the seamless three-dimensional cover (1) comprising of at least one glass base layer (3) and at least one glass rim layer (4). At least one layer of color inducing film (5) is arranged between at least one of the base layer (3) and the rim layer (4), or between two adjacent rim layers (4). The base layer (3), the rim layer(s) (4), and the layer of color inducing film (5) are fused together to form the seamless three-dimensional cover (1). This facilitates a strong and durable three-dimensional cover, which cover is translucent as well as at least partially colored. Furthermore, the cover does not affect the function of components such as millimeter-wave antennas.

A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/μm.sup.2 at B10 (10.sup.th percentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.