The present disclosure relates to the field of storage bags, and discloses a fireproof, explosion-proof and heat-insulating storage bag, including a storage bag body, where the storage bag body is composed of a first fireproof fabric, a heat insulation material, an auxiliary molding material, and a second fireproof fabric. In the present disclosure, different specifications of models are formed by a fireproof and explosion-proof material, the heat insulation material and an auxiliary molding material; a plurality of materials are integrated to achieve fireproof, explosion-proof and heat-insulating functions, so that it is ensured that the product cannot be damaged within a certain period of time when placed on a fire source, and no spontaneous combustion occurs inside the storage bag. The fire source leakage is prevented, the fire source is prevented in the storage bag, and no fire is caused, thereby achieving the fireproof, explosion-proof and heat-insulating functions.

A thermal insulation component according to various aspects of the present disclosure includes a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix includes a thermal insulation material having a thermal conductivity of less than or equal to about 5 W/mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor includes at least one of an acrylate functional group or a methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor. In certain aspects, the present disclosure also provides an electronics assembly including an electronic component and a thermal insulation material in thermal communication with the electronic component. In certain aspects, the present disclosure also provides methods of manufacturing the thermal insulation component.

Provided are wallboard panels that include a foam material layer and a core material, with one or more sheets of facer material and/or one or more sheets of backing material. The foam material layer may include one or more pores having an open pore geometry. Additionally, provided are methods of manufacturing such wallboard panels.

A kit for forming a panel including a panel component, the panel component including a surface sheet formed from a first material, and a body layer to which the surface sheet is adhered generally parallel to the body layer, wherein the body layer has a thickness greater than a thickness of the surface sheet, the body layer has a density less than a density of the surface sheet, and a separate side edge portion adapted to be adhered along at least one edge of the panel component.

A kit for forming a panel including a panel component, the panel component including a surface sheet formed from a first material, and a body layer to which the surface sheet is adhered generally parallel to the body layer, wherein the body layer has a thickness greater than a thickness of the surface sheet, the body layer has a density less than a density of the surface sheet, and a separate side edge portion adapted to be adhered along at least one edge of the panel component.

A building board, particularly a gypsum board, can have a high fastener sealability if protected by the combination of thin layers of an extruded polymer film and a thermoplastic coating layer. The combination of extruded polymer film and thermoplastic coating layer is designed such that the gypsum board can also tolerate overdriven fasteners, thus exceeding the requirements of ASTM D1970-15.

A resin molded product, a laminate, and a decorative sheet having high weatherability. A decorative sheet includes a resin molded product as a protective layer, and the resin molded product includes an ultraviolet absorber having pKa of −5.5 or more and −4.5 or less when irradiated with light, and a photostabilizer having pKa of 3.0 or more and 7.0 or less. The added amount of each of the ultraviolet absorber and the photostabilizer is 3.0 parts by mass or less per 100 parts by mass of the resin.

A thermosetting composition including at least a thermosetting compound, the thermosetting composition satisfying relationships represented by formulas (i) and (ii) below:

0.80≤b/a≤0.98  (i), and

0.05≤c/a≤0.30  (ii), wherein a, b, and c represent storage moduli (unit: GPa) at 30° C., 100° C., and 260° C., respectively, of a cured product formed by curing a prepreg obtained by impregnating or coating a base material with the thermosetting composition.

A prepreg, a laminated board, and a printed circuit board thereof are provided. The prepreg includes a halogen-free epoxy resin composition and a partially cured non-woven reinforcing material impregnated therein. The non-woven reinforcing material has a dielectric strength of 1.5 to 4.8 and a loss factor that is less than 0.003 at 10 GHz, and the halogen-free epoxy resin composition includes: (a) 100 parts by weight of a halogen-free naphthalene type epoxy resin, (b) 10 to 25 parts by weight of a DOPO modifying curing agent, (c) 25 to 45 parts by weight of a cyanate resin, (d) 35 to 60 parts by weight of bismaleimide, (e) 45 to 65 parts by weight of a non-DOPO flame retardant, and (f) 0.5 to 15 parts by weight of a curing accelerator.

A shingle coating asphalt composition is provided that is produced from a paving grade asphalt. The asphalt composition comprises a paving-grade asphalt that has been modified with one or more polymer additives; and a secondary additive comprising one or more of a viscosity reducing agent, a wax, a salt of a fatty acid ester, and an amide of a fatty acid. The shingle coating asphalt coating composition is used to make a shingle. The shingle includes a substrate, the asphalt, and roofing granules.