Multi-layer composite material, production and use thereof A multilayered composite material comprises as components: (A) a sheet material, (B) a material capable of absorbing water or aqueous fluids, (C) at least one bonding layer and (D) a polyurethane layer with capillaries passing through the entire thickness of the polyurethane layer,
wherein the polyurethane layer (D) comes into direct contact with sheet material (A) or absorption-capable material (B) in one or more places.

Multi-layer composite material, production and use thereof A multilayered composite material comprises as components: (A) a sheet material, (B) a material capable of absorbing water or aqueous fluids, (C) at least one bonding layer and (D) a polyurethane layer with capillaries passing through the entire thickness of the polyurethane layer,
wherein the polyurethane layer (D) comes into direct contact with sheet material (A) or absorption-capable material (B) in one or more places.

A porous ceramic structure includes one sheet, and a porous ceramic aggregate bonded on the sheet. The porous ceramic aggregate includes a plurality of porous ceramic particles.

A process for forming a moldable, uncured nonwoven composite containing forming a outermost nonwoven layer, forming a structural nonwoven layer, needling the structural nonwoven layer and the outermost nonwoven layer together from both the outer surface of the outermost nonwoven layer and the second surface of the structural nonwoven layer, applying an uncured, water-based thermosetting resin having a cure temperature of at least about 160° C. to the second surface of the structural nonwoven layer, and at least partially drying the uncured, wet nonwoven composite. Heat and pressure may be applied to form the moldable, uncured composite. A moldable, uncured nonwoven composite and a molded, cured nonwoven composite are also disclosed.

A process for forming a moldable, uncured nonwoven composite containing forming a structural nonwoven layer, at least partially impregnating the structural nonwoven layer with an uncured, water-based thermosetting resin having a cure temperature of at least about 160° C., and at least partially drying the uncured, wet nonwoven composite such that the temperature at the inner plane is less than about 130° C. forming an moldable, uncured composite. The structural nonwoven layer contains a plurality of bi-component binder fibers and a plurality of reinforcing fibers, the bi-component fibers containing a core and a sheath. The core contains a polymer having a melting temperature of at least about 180° C. and the sheath contains a polymer having a melting temperature less than about 180 ° C. A process for forming a molded, cured composite containing forming a structural nonwoven layer and a molded cured nonwoven composite are also disclosed.

A process for forming a moldable, uncured nonwoven composite containing forming a structural nonwoven layer, at least partially impregnating the structural nonwoven layer with an uncured, water-based thermosetting resin having a cure temperature of at least about 160° C., and at least partially drying the uncured, wet nonwoven composite. The structural nonwoven layer contains a plurality of binder fibers and a plurality of reinforcing fibers which are cellulosic fibers. Heat and pressure are applied to the moldable, uncured composite to a temperature of at least about 160° C. at least partially melting the binder fibers, curing the water-based thermosetting resin, and bonding at least a portion of the reinforcing fibers to other reinforcing fibers forming the molded, cured composite. The reinforcing fibers react with and form covalent bonds with the thermosetting resin.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

A moisture resistant carpet exhibiting exceptional delamination strength and methods of making same are disclosed.

A method for forming an antislip material. A flexible thermoplastic carrier is provided. A hot release surface is provided. Provided is a first layer of discrete thermoplastic particles, sifting on the hot release surface. The discrete particles are above their softening temperatures, providing in the first layer a tackiness. The method includes contacting the carrier with the tacky first layer for sticking the first layer to the carrier, and thereafter removing the carrier, and therewith the tacky first layer stuck to the carrier, from the release surface. Thereby the carrier is provided with a hot, preferably discontinuous and/or elastomeric antislip coating. With a heat energy of the hot coating a bond is formed between the carrier and the coating. The removing of the carrier includes pulling the carrier out of the contact with a pulling-out force. The temperature of the hot release surface is above the melting temperature of the carrier. The carrier would be spoiled, if heated completely to the temperature of the release surface and simultaneously pulled with the pulling-out force. Therefore the contacting time is kept shorter than a minimum time required by a heat of the hot release surface for spoiling the carrier. Flat-topped roughening projections can be included in the antislip coating.

A method for forming an antislip material. A flexible thermoplastic carrier is provided. A hot release surface is provided. Provided is a first layer of discrete thermoplastic particles, sifting on the hot release surface. The discrete particles are above their softening temperatures, providing in the first layer a tackiness. The method includes contacting the carrier with the tacky first layer for sticking the first layer to the carrier, and thereafter removing the carrier, and therewith the tacky first layer stuck to the carrier, from the release surface. Thereby the carrier is provided with a hot, preferably discontinuous and/or elastomeric antislip coating. With a heat energy of the hot coating a bond is formed between the carrier and the coating. The removing of the carrier includes pulling the carrier out of the contact with a pulling-out force. The temperature of the hot release surface is above the melting temperature of the carrier. The carrier would be spoiled, if heated completely to the temperature of the release surface and simultaneously pulled with the pulling-out force. Therefore the contacting time is kept shorter than a minimum time required by a heat of the hot release surface for spoiling the carrier. Flat-topped roughening projections can be included in the antislip coating.